Chemical Mechanical Planarization (CMP) is a semiconductor manufacturing process that uses an abrasive (mechanical), corrosive (chemical) slurry to physically grind flat the microscopic topographic features on a partly processed wafer so subsequent processes can begin from a flat surface. This flatness is essential given the small size and complexity of today's semiconductor devices.
The planarization occurs using abrasive particles and chemicals in a slurry in conjunction with a polishing pad. Pads held to the wafer by retaining rings move at various rates and axes of rotation creating mechanical planarization while chemicals in the slurry react with and/or weaken the material to be removed.
In August 2005, two industry leaders merged advancing the technology available to the CMP segment. Linking the filtration experience of Mykrolis and the fluid control expertise of Entegris better slurry delivery is possible.
- Filtration
Entegris now provides filtration that helps ensure quality slurry is delivered to the wafer reducing wafer defects and increasing yields in CMP processes. Planargard® depth media cartridge filters remove particles that are disruptive to CMP. Many options exist to match application filtration objectives. Chemlok® housings and Planarcap® point-of-use disposable filters offer other options.
- Fluid Control and Delivery
Flow controllers and fluid components from Entegris deliver the slurry and other chemistries to the wafer. The NT® integrated flow controller enables precise automated control of point-of-use blending and dispense applications. The NT® electronic flowmeter provides precise flow rate and pressure outputs simultaneously. The compact, modular design of the Dymension® surface mount manifold lowers cost of ownership. Integra® valves provide reliable service while increasing flow and reducing footprint. Solaris® DVP system offers filtration with pressure monitoring and alarms.
- PVA Brushes
Planarcore® PVA brushes clean slurry haze from wafers after processing. This disposable brush reduces tool downtime and decreases on-wafer defects. Its dimensional stability and core flow equalization delivers wafer to wafer uniformity unseen in post-CMP applications.