In the semiconductor industry, everything is about the wafer. After all, the wafer is the substrate on which every process is performed. And, where does the wafer spend most of it's time? In the wafer carrier.
A pristine environment surrounding the wafer is required. It is needed at the wafer manufacturer, while the wafer moves to the device manufacturer, during processing and on through testing-from production to consumption. This environment is required within a wafer carrier or shipper that must operate reliably with many pieces of equipment.
Entegris is the industry leader and supplier of choice for predictable, reliable and innovative wafer handling solutions. Combined with Entegris service solutions, customers have a cost-effective means to manage silicon from its manufacturer to the IC user. Secure protection of the wafer and precise automation interface with equipment increase yields and minimize unscheduled downtime.
Maximum protection for wafers during shipping is provided by the SB300 FIMS Compatible Full Pitch Front Opening Shipping Box (FOSB) offering reliable automation interface and interoperability. An Automated FIMS door reduces the labor costs and human error associated with manual FOSB handling, and minimizes contamination potential from ambient environments and human contact.
The SpectraTM wafer carrier is a 25-capacity front opening unified pod (FOUP) that provides clean, secure wafer transport, optimum automation integration and the highest overall output for your facility. This carrier is Entegris' platform for all advanced 300mm wafer processing and is aimed at meeting future customer needs.
Of equal importance to safely transporting the wafer around the fab is safe-guarding the wafer inside each process. Entegris' Electrostatic Clamps provide a "touch-free" "clamping" environment as the wafer is processed.
Service Solutions offer on-site and off-site cleaning, recycling and certified re-use of Entegris and competitive products. Service Solutions enable customers to focus on core competencies while reducing capital expenditures.