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3D IC Technology - Needs and Tomorrow's Challenges

Wednesday, May 14, 2014
Leuven, Belgium

Hotel The Lodge Heverlee


Entegris, in collaboration with imec, Fraunhofer, Fujifilm, Mechatronic and SEMI®, cordially invites you to attend a seminar on the challenges of 3D IC technology. Hear from multiple points of view, and learn about current and future developments.


Take this opportunity to:

  • Meet the experts
  • Share your experience
  • Expand your network


We are looking forward to meeting you at the Entegris 3D seminar.

The Entegris Team


Please contact Françoise Moign at for more information.


Click here to register for this event.


More information on this event can be found at and


Download the seminar program in PDF format.


10.00 Opening
Luc van Autryve, 3D IC Worldwide Program Manager – Entegris

10.15 3D IC Standards: Cornerstone of Successful High Volume Manufacturing Products
Yann Guillou, Business Development Manager – SEMI® Europe, Grenoble

10.45 3D Integration Roadmap and Challenges
Gerard Beyer, PhD, Program Manager 3D – imec

11.30 Materials Research and Nanoanalysis – Keys for Reliable 3D Products
Martin Gall, Ph.D. – Department Head, Materials and Reliability for Micro- and Nanoelectronics Fraunhofer Institute for Ceramic Technologies and Systems IKTS-MD

12.00 Packing – Unpacking and Sorting
Mr. Werner Kornmayer, Sales Manager – Mechatronic

13.30 3D and Thin Wafer Handling Solutions
Paul Rosenfeld, Director Business Development – Entegris

14.00 Novel Low Temperature Cure Dielectrics for Improved Package Reliability Typical for Wafer Level Packaging and 3D/IC Stacked Packages
Stefan Vanclooster, Business Development Manager – Fujifilm Electronics Materials Europe

14.30 IntelliGen® HV Filtration and Dispense System Dedicated to High Viscosity Chemicals
Laurent Stock, Global Product Support – Entegris

14.50 Panel Discussion on Universal Thin Wafer Handling in 3D