COEXFebruary 7-9, 2012Seoul, KoreaHall D, Booth 5606
San Jose Convention CenterFebruary 12-16, 2012San Jose, CA USA
Tokyo Big SightFebruary 29 - March 2, 2012Tokyo, Japan
Shanghai New International Expo CentreMarch 20-22, 2012Shanghai, China
Build a fitting part number based on your configuration, size and connection requirements – all from your mobile device.
Clean, robust and very easy to assemble.
Coatings with excellent adhesion, high wear resistance and low coefficient of friction.
Developing the world’s most advanced wafer handling for your transition to 450 mm
Offers increased protection, higher shipment density, reuse and recycling, and automation
Entegris offers a dynamic environment.