Molded-through-the-core PVA brushes for post-CMP equipment by Applied Materials®, Ebara® and Ontrak®
Planarcore® PVA brushes provide a fundamental advantage over standard friction-fitted brushes: The molded-through-the-core design provides consistent gapping, eliminates slippage and prevents loss of concentricity – reducing wafer defectivity. The investment in the wafer at the post-CMP stage is at one of the highest points depending on the layer count. An effective and value-added post-CMP cleaning operation is critical to ensure each wafer moves forward with a consistent surface condition. Planarcore PVA brushes from Entegris provide this level of consistency.