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CMP Slurry

Graded density media for point-of-use and bulk applications

 

Point-of-Use (POU) and Bulk CMP filters enable process advancements to address two key end-user needs:  reduce defects and improve cost of ownership (COO). Solaris® CL (Point-of-Tool) and Planarcap® KPX (Point-of-Dispense) CMP filters provide a broad range of filtration solutions for ILD, Cu, W and STI process steps. The unique combination of depth media and graded media pleating technologies enable our customers to match the right filter for the right application. For bulk and BCDS slurry filtration, Planargard® melt-blown graded density slurry filters provide CMP applications the critical performance balance between the removal of defect-causing agglomerate gels and the delivery of the necessary slurry solution to the wafer surface. Designed for use in copper, STI, ILD and tungsten applications, the wide variety of Planargard® filters capture particles in silica, ceria or alumina slurries.
Bulk/Facilities CMP Filter
High volume filtration of bulk slurry
  • Nonwoven media design enables the filter to retain defect-causing agglomerates with high efficiency
  • Removes only those particles that are disruptive - avoiding altering the particle size distribution of the "working" slurry particles
  • Available in 0.2 to 50 µm retention ratings
Point-of-Tool (POT) Filtration
Installed on the CMP tool
  • Unique depth media design balances high particle retetion with greater surface area and increased depth for improved gel holding capacity
  • Self-venting design eliminates dead space and prevents slurry dry out in the filter - prolonging overall lifetime
  • Available in 0.3 to 5.0 µm retention ratings retention ratings to capture large and small defect-causing gels and agglomerates
  • Disposable, Connectology® design enables quick filter changeout and limits chemical exposure to operators
Point-of-Dispense (POD)
Installed at the point-of-dispense in the CMP Tool
  • Developed to be installed at the point-of-dispense (POD) on the CMP slurry tool to prevent wafer contamination
  • Removes defect-causing agglomerates and gels from CMP slurries
  • Optimized graded-density depth media pleated design to provide the best combination of surface area and media gradient