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Electroplating

Filtration for Cu and Ni plating processes

Liquid filtration of sulfate-based chemistries used for electroplating/electrodeposition of copper and nickel. Generally these materials are a mixture of copper or nickel sulfate with organic additives. Entegris filters recommended for resist stripping applications are suitable for batch or single-wafer processes and utilize PTFE and UPE membranes for ultra purity and durability.

Guardian™ ECD Cartridge Filters
Hydrophilic, high-flow inert membrane with excellent flow/retention properties, ideal solution for wet cleans and CuECD
  • Provide excellent chemical compatibility, downstream chemical cleanliness, reduced system startup times and long lifetime
  • Highly hydrophilic surfaces reduce the potential for microbubble formation
  • High-flow asymmetric membrane delivers excellent performance while minimizing system pressure drop
  • Non-interactive surfaces will not react with typical plating additives and related process chemistries – ensures ultimate process protection