Click the video icon to view a brief message from Gary Gallagher, Vice President of 300 mm Process Products.

Spectra™ FOUP Technology Advancements

Entegris now offers several new enhancements to its 300 mm FOUP line of products. These include a new FM4911-approved FOUP made with TEGO™ material for reduced risk of fire and smoke propagation in the fab, along with greatly-reduced costs for insurance; new snorkel technology to allow for dramatic purge time reductions; the Clarilite® wafer fits in any wafer slot to absorb contaminants and moisture during storage in order to maintain a clean microenvironment; and new barrier materials that help prevent permeation of contaminants through the FOUP shell, allowing for longer queue times and increased yields.

EUV Pod

Successful wafer fabrication using Extreme Ultra Violet (EUV) technology requires several advancements to reticle carriers to ensure defect-free reticle handling. Entegris has collaborated with leading lithography equipment suppliers and industry organizations in the development of an EUV mask carrier capable of meeting these stringent requirements.

The EUV pod from Entegris is a dual pod design having both an inner carrier and outer shell to maintain a contamination-free environment. In laboratory tests, the EUV pod was shown to provide defect-free protection of EUV reticles during shipping, storage, handling and vacuum-transferring operations with 40 nm SiO₂ equivalent particle sizes.

450 mm Wafer Carrier

Entegris has launched a new, beta 450 mm wafer carrier to permit early 450 mm equipment integration and wafer handling studies based on the latest 450 mm fab carrier SEMI® standards. In addition to this launch, Entegris recently introduced a 450 mm single wafer shipper and a 450 mm multiple wafer shipper (FOSB). Entegris’ beta 450 mm FOSB, with ISTA-qualified secondary packaging system, permits successful shipments of 450 mm wafers worldwide.

300 mm Prime Small-Lot FOUP

Entegris has introduced its 300 mm Prime small-lot FOUP to help optimize workflow and reduce cycle times in support of the 300 mm Prime initiative. The small-lot FOUP features advanced perimeter sealing technology that reduces particle contamination and simplifies door closure and opening, leading to greater load-port efficiency and reliability.

In addition, users can stack three small-lot FOUPs in the same footprint as one existing 300 mm FOUP, saving valuable fab space and improving manufacturing efficiencies.