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As electronics and thermodynamic systems continually increase performance, the localized heat generated in those systems grows exponentially. We offer a family of thermal management materials including POCO HTC (High Thermal Conductivity) and POCOFoam®. These highly engineered materials rapidly channel heat uni-directionally away from sensitive areas, extending the lifetime and enhancing performance of these systems. Heat sinks using both aerodynamic and enthalpic heat transfer are possible, with a range of density potential that allows designers to maximize the trade between speed of heat removal and system capacity.