The drive toward making electronics faster, denser, and cheaper continues unabated. Shrinking device dimensions and structure changes place additional demands on the materials used in all steps of semiconductor processing. As device scaling continues, contamination and material purity become more important than ever and can be tackled by changing how deposition and etch tools are coated. Integrating new chemistries in deposition and etching steps can alleviate vertical scaling challenges as well.
With our advanced materials science expertise and our determination to help solve your most advanced technology challenges, we are prepared to help you maintain unprecedented levels of cleanliness. By providing precision-engineered specialty coatings and innovative precursor and plasma combinations for your applications, together we can enable high throughput and high yield to support the ever-increasing device storage needs.
96 Layers and Beyond: 3D NAND Material and Integration challenges
Decades-old practices are no longer effective when increasing the number of 3D NAND structures to 96 layers and beyond.