Please enter the email address for your account. A link to change your password will be emailed to you.All Fields Required
Solving 3D NAND Material and Integration challenges
Decades-old practices are no longer effective when increasing the number of 3D NAND structures to 96 layers and beyond.
Contamination and purity challenges can be tackled by changing how deposition and etch tools are coated, while integrating new chemistries in deposition and etching steps can alleviate vertical scaling challenges.