The Surface Preparation and Cleaning Conference (SPCC) 2018 is the world's largest conference dedicated to cleaning and preparation. This annual event brings together prominent researchers from the semiconductor industry and the university community to focus on developments and challenges in advanced wafer and mask cleaning and surface preparation technologies.
SPCC offers a unique opportunity for IC manufacturers, equipment makers, chemical and material suppliers, metrology and process monitoring suppliers, and researchers to hear presentations on cutting edge research cleaning technologies for the electronics industry. The scope of the conference encompasses front-end, back-end, equipment, materials, metrology, and equipment developments and issues in wafer cleaning.
The Surface Preparation and Cleaning Conference (SPCC) 2018 is the world's largest conference dedicated to cleaning and preparation. This annual event brings together prominent researchers from the semiconductor industry and the university community to focus on developments and challenges in advanced wafer and mask cleaning and surface preparation technologies.
SPCC offers a unique opportunity for IC manufacturers, equipment makers, chemical and material suppliers, metrology and process monitoring suppliers, and researchers to hear presentations on cutting edge research cleaning technologies for the electronics industry. The scope of the conference encompasses front-end, back-end, equipment, materials, metrology, and equipment developments and issues in wafer cleaning.
/content/entegris-live/en/home/about-us/events/surface-preparation-and-cleaning-conference-2018Technologists, academics, product managers, and marketing managers focused on solving problems in semiconductor cleaning technology will benefit from the Surface Preparation and Cleaning Conference.
The conference comprises invited presentations, reviewed technical oral presentations and posters covering all aspects of cleaning. Invited expert speakers will review key aspects of the surface preparation and cleaning markets.
Entegris is proud to be a Gold Sponsor.
Conference Presentations
Future Development Challenges for Post-CMP Cleaning
Michael White, Entegris
Increasing use of new materials corresponds to increasing cleaning complexity. Here is how Entegris addresses these challenges.
Fundamentals of Post-CMP Cleaning of Dielectric Surface Contaminated with Ceria (Nano-to-Micro) Particles
Atanu Das, Entegris
Understanding the nature of Ceria surface and interaction with the Silica surface are the key to designing the proper cleaner.
Ammonia cross contamination: FOUP to wafer evaluation and their volatile acids comparison
Paola Gonzalez, Entegris
FOUP's appearance in terms of AMC cross-contamination must be assessed by wafer exposure
Featured Products
Planarcore® PVA Brushes are designed to deliver superior performance and wafer-to-wafer uniformity in post CMP wafer cleaning applications. The unique molded-through-the-core technology provides absolute adhesion of the PVA to the brush core, unlike standard PVA products that are merely friction fitted to the core.
PlanarClean® AG Cleaning Solutions are designed for advanced Cu post-CMP process. The proprietary formulations offer increased performance through enhanced reliability and yield, low to zero corrosion and defects and increased queue time.
Best-in-class, bulk slurry filter with ultra-high particle loading capacity for bulk processes in sub 45 nm technology nodes. Enables superior hard particle removal and gel retention performance to prevent microscratches.
Micro-machined SiC substrate with conformal CVD diamond coating delivers long-life, highly uniform pad conditioning while minimizing substrate damage. Planargem® CMP Pad Conditioners offer leading-edge, customer-tailored performance across all aspects of the CMP Process.
Best-in-class, point-of-dispense slurry filter with ultra-high particle loading capacity in sub 45 nm technology nodes to prevent microscratches. Enables superior hard particle removal and gel retention performance.