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The NT™ Proportional Control Valve, Model 6300 Cv 5.6 - 10 is developed for use in ultra high-purity applications. Compatible with highly corrosive processes and designed for use in CMP slurry applications.
Flow Factor
- > 2.8
- Semiconductor
- Bulk Chemical Delivery
- CMP
- Photolithography
- Wafer Growing
Our catalyst and adsorber, PS6, O2 bulk gas purifiers efficiently remove H2O, CO, CO2, H2, and THC at flow rates up to 16,667 slpm (1,000 Nm3/hr).
Gases Purified
- Oxygen (O2)
Safely secure 2.5”, 2.25”, and 2” wafers in our convenient, easy to use wafer carriers
Product Type
- Process wafer carrier
See specifications for AXF-5Q implantable graphite. Graphite without tungsten impregnation suitable for U.S. FDA Class II and III applications.
Shore Hardness
- 74
- 1.78 (0.064)
- 7.9 (4.4)
- 138 (20,000)
ST-28M plasma residue remover has been formulated to remove the residues associated with high energy plasma etchers and small geometry devices. ST-28M can be used to remove both organic and inorganic residues, but is especially effective in removing the residues remaining after today’s high temperature O2 ash processes
Interconnect Technology
- Al
- 250, 130, 90, 65
- Semiconductor
- Post CMP
The larger 6" pressure vacuum vessel gives you 2.5 times more volume per inch than the 4" vessels, enabling you to dispense more fluid in less space.
Size
- 6"
Numerous kits are available to help you maintain a contamination-controlled M200 wafer SMIF pod
Product Type
- Maintenance kit or accessory
- 25
- 26
- 25/26
The E04 Wafer Storage Box delivers convenient, one-wafer capacity for 2.5” and smaller wafers
Product Type
- Storage box
Our dual capacity injection molded tank enables you to process twice as many 150 mm cassettes in half the time
Capacity
- Dual
- Rectanglular
- 150 mm
- Semiconductor
Advanced wafer SMIF pods for 200 mm fabs provide reliable wafer isolation in a controlled environment
Product Type
- Wafer SMIF pod
- 26
- 25
- 13
- Semiconductor
- Wafer Handling