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PES 0.22 µm capsule filter that delivers superior flow rates in a broad range of chemical conditions to deliver significant economic advantages
Brand Name
  • Pharmsteri™
Chemistry
  • Acids
  • Buffers
  • Bases
Industry
  • Life Sciences
  • Pharmaceutical
Process
  • Steam-in-Place (SIP)
ST-26S solution contains a complexing agent which greatly enhances the removal of residual metal oxides and other inorganics formed during aggressive plasma etching and ashing. This unique solution effectively permeates heavily oxidized residues and rapidly dissolves them before they can redeposit back onto the substrate. Formulated with an extremely low operating viscosity and a corrosion reducing component, ST-26S is ideal for use in automated photoresist stripping equipment.
Interconnect Technology
  • Al
Technology Node (nm)
  • 250, 130, 90, 65
Industry
  • Semiconductor
Process
  • Post CMP
The NT™ Proportional Control Valve, Model 6300 Cv ≤ 2.8 is developed for use in ultra high-purity applications. Compatible with highly corrosive processes and designed for use in CMP slurry applications.
Flow Factor
  • ≤ 2.8
Industry
  • Semiconductor
Process
  • Bulk Chemical Delivery
  • CMP
  • Photolithography
  • Wafer Growing
  • Wet Etch and Clean
Deliver field- and lab-proven performance in advanced manufacturing environments in semiconductor, flat panel, and LED fabs
Contaminants
  • Acids
  • Bases
  • Organics
Industry
  • Semiconductor
  • Data Storage
  • LED
Process
  • CMP
  • Deposition
  • Dry Etch
  • Ion Implant
  • Photolithography
  • Wet Etch and Clean
  • Magnetic Head - Photolithography
  • Magnetic Head - CMP
  • Magnetic Head - Wet Etch and Clean
Best-in-class, leading-edge filtration of solvents and BEOL chemistries
Brand Name
  • Torrento®
Chemistry
  • Solvent
Feature Size (Layer)
  • <10 nm
  • 14-22 nm
Installation Point
  • Point of Tool
  • Point of Dispense
  • Bulk
Small volume, point of dispense acid, base and solvent filter
Brand Name
  • Fluoroline™
Chemistry
  • Photochemical
  • Solvent
  • Aggressive Acids
  • Aggressive Bases
  • Dilute Acids
  • Dilute Bases
Feature Size (Layer)
  • >90 nm
Installation Point
  • Point of Dispense
GateKeeper® HX Series - Gases Purified: Hydrogen (H2), Nitrogen (N2) or Argon (Ar). Continuous flow, point-of-use purified hydrogen, nitrogen or argon gas at a low cost of ownership.
Gases Purified
  • Argon (Ar)
  • Hydrogen (H2)
  • Oxygen (O2)
Our porous graphite that has high thermal conductivity and very efficient thermal energy transfer characteristics.
Material
  • Porous Graphite
Industry
  • General Industrial
Our GPU gas purifiers efficiently remove halogenated gases, hydrides, reactive oxides, saturated and unsaturated hydrocarbons, fluorocarbons and chlorocarbons at a variety of flow rates.
Gases Purified
  • Other gases
  • Xenon (Xe)
  • Helium (He)
  • Argon (AR)
  • Hydrogen (H2)
  • Carbon dioxide (CO2)
  • Oxygen (O2)
  • Ammonia (NH3)
  • Nitrogen (N2)
  • Extreme clean dry air (XCDA®)
UltraPur™ TEPO is a liquid precursor used in the deposition of doped silicate glass.
CAS #
  • 78-40-0
Chemical Formula
  • C6H15O4P
Element
  • Triethylphosphate
Industry
  • Semiconductor
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