Narrow Your Selection
  • Technology Node (nm)
ESC 784 is a cost-effective cleaning product specially developed for cleaning hydrophobic surfaces in copper integration processing. This cleaning solution utilizes a high-pH formulation that removes contaminants generated by CMP process, while preventing corrosion of copper substrates.
Interconnect Technology
  • Cu
  • Al
  • WLP
Technology Node (nm)
  • 130
  • 90
  • 65
  • 45
  • 40
  • 32
  • 28
ST-44 positive resist stripper is the first positive photoresist stripper specifically formulated from organic solvent blends to be effective in removing hard-to-strip positive photoresists from metal and metal alloy surfaces – surfaces that are sensitive to corrosion from electrolytic or galvanic effects.
Interconnect Technology
  • Al
Technology Node (nm)
  • 250, 130, 90, 65
ST250™ Cu residue remover solution is specifically formulated for maximum compatibility with copper, advanced barrier layer and etch-stop materials.
Interconnect Technology
  • Cu, WLP
Technology Node (nm)
  • 130, 90, 65, 45, 40, 28, 16, 10
If you'd like to add this item to compare, please uncheck one of the other 4 items. If you'd like to add this item to compare, please uncheck one of the other 2 items.