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  • Usage
  • Technology Node (nm)
ST-22 positive resist stripper is a positive photoresist stripper specifically formulated from organic solvent blends to be effective in removing hard-to-strip positive photoresists. ST-22 is completely water soluble, contains no phenols, chlorinated hydrocarbons, or other toxic materials. In addition, ST-22 is formulated for ease of disposal.
Interconnect Technology
  • Al
Technology Node (nm)
  • 250, 130, 90, 65
ST-33 positive resist stripper is formulated from organic solvents to be effective in the removal of positive photoresists from corrosion-sensitive substrates. It has a unique chemistry that eliminates corrosive etching of GaAs and other III-V metals and copper.
Interconnect Technology
  • Al
Technology Node (nm)
  • 250, 130, 90, 65
The Entegris series of ST-200 Solutions has been formulated to remove heavily oxidized plasma etch residues from small geometry devices. The products contain no SARA-reportable components such as ethylene glycol ether based solvents, N-Methylpyrrolidone, or highly reactive materials such as hydroxylamine.
Interconnect Technology
  • Al
Technology Node (nm)
  • 130, 90, 65
ST-28M plasma residue remover has been formulated to remove the residues associated with high energy plasma etchers and small geometry devices. ST-28M can be used to remove both organic and inorganic residues, but is especially effective in removing the residues remaining after today’s high temperature O2 ash processes
Interconnect Technology
  • Al
Technology Node (nm)
  • 250, 130, 90, 65
ST250™ Cu residue remover solution is specifically formulated for maximum compatibility with copper, advanced barrier layer and etch-stop materials.
Interconnect Technology
  • Cu, WLP
Technology Node (nm)
  • 130, 90, 65, 45, 40, 28, 16, 10
Optically based sensor detects and monitors low levels of dissolved oxygen in chemical plating applications
Materials of Construction
  • PTFE wetted body
Channels
  • 1
Measurement
  • Dissolved oxygen
Usage
  • In-situ
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