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SEMICON® Taiwan 2017 Corporate Sep. 13, 2017 - Sep. 15, 2017 Taipei, Taiwan  Taipei Nangang Exhibition Center
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  • Industry
  • Process
ESC 784 is a cost-effective cleaning product specially developed for cleaning hydrophobic surfaces in copper integration processing. This cleaning solution utilizes a high-pH formulation that removes contaminants generated by CMP process, while preventing corrosion of copper substrates.
Interconnect Technology
  • Cu
  • Al
  • WLP
Technology Node (nm)
  • 130
  • 90
  • 65
  • 45
  • 40
  • 32
  • 28
Industry
  • Semiconductor
Process
  • Post CMP
ESC T794 is a cost-effective cleaning product specially developed for cleaning hydrophobic surfaces in copper integration processing. This cleaning solution utilizes a high-pH formulation that removes contaminants generated by CMP process, while preventing corrosion of copper substrates.
Interconnect Technology
  • Cu
Technology Node (nm)
  • 130
  • 90
  • 65
  • 45
  • 40
  • 32
  • 28
Industry
  • Semiconductor
Process
  • Post CMP
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