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  • Port Connection
  • Port Size
  • Industry
  • Process
All Teflon® material wetted surfaces and an o-ring-free design provide corrosion resistance and reduce contamination in high-purity chemical applications. 3/4" orifice with numerous end connections.
Port Connection
  • PrimeLock®
  • Flaretek®
  • PureBond® pipe
Port Size
  • 3/4"
Industry
  • Semiconductor
  • LED
  • Flat Panel Display
  • Data Storage
Process
  • Bulk Chemical Delivery
  • CMP
  • Photolithography
  • Wet Etch and Clean
  • Lithography
  • Cleaning
  • Substrate Cleaning
  • Substrate - IPA
  • Substrate - Polishing
  • Media - Cleaning
  • Media - IPA
  • HDD Assembly - Cleaning
  • Magnetic Head - Photolithography
  • Magnetic Head - Wet Etch and Clean
  • Magnetic Head - CMP
  • HGA/HSA Assembly - Cleaning
All Teflon® material wetted surfaces and an o-ring-free design provide corrosion resistance and reduce contamination in high-purity chemical applications. 1" orifice with numerous end connections.
Port Connection
  • PrimeLock®
  • Flaretek®
  • PureBond® pipe
Port Size
  • 1"
  • 1 1/4"
Industry
  • Semiconductor
  • LED
  • Flat Panel Display
  • Data Storage
Process
  • Bulk Chemical Delivery
  • CMP
  • Photolithography
  • Wet Etch and Clean
  • Lithography
  • Cleaning
  • Substrate Cleaning
  • Substrate - IPA
  • Substrate - Polishing
  • Media - Cleaning
  • Media - IPA
  • HDD Assembly - Cleaning
  • Magnetic Head - Photolithography
  • Magnetic Head - Wet Etch and Clean
  • Magnetic Head - CMP
  • HGA/HSA Assembly - Cleaning
All Teflon® material wetted surfaces and an o-ring-free design provide corrosion resistance and reduce contamination in high-purity chemical applications. 1/2" orifice with numerous end connections.
Port Connection
  • PrimeLock®
  • Flaretek®
  • PureBond® pipe
  • Super 300 Type Pillar®
  • FNPT
Port Size
  • 1/2"
Industry
  • Semiconductor
  • LED
  • Flat Panel Display
  • Data Storage
Process
  • Bulk Chemical Delivery
  • CMP
  • Photolithography
  • Wet Etch and Clean
  • Lithography
  • Cleaning
  • Substrate Cleaning
  • Substrate - IPA
  • Substrate - Polishing
  • Media - Cleaning
  • Media - IPA
  • HDD Assembly - Cleaning
  • Magnetic Head - Photolithography
  • Magnetic Head - Wet Etch and Clean
  • Magnetic Head - CMP
  • HGA/HSA Assembly - Cleaning
All Teflon® material wetted surfaces and an o-ring-free design provide corrosion resistance and reduce contamination in high-purity chemical applications. 1/4" orifice with numerous end connections.
Port Connection
  • PrimeLock®
  • Flaretek®
  • PureBond® pipe
  • Quikgrip®
  • Super 300 Type Pillar®
  • FNPT
  • MNPT
Port Size
  • 1/4"
Industry
  • Semiconductor
  • LED
  • Flat Panel Display
  • Data Storage
Process
  • Bulk Chemical Delivery
  • CMP
  • Photolithography
  • Wet Etch and Clean
  • Lithography
  • Cleaning
  • Substrate Cleaning
  • Substrate - IPA
  • Substrate - Polishing
  • Media - Cleaning
  • Media - IPA
  • HDD Assembly - Cleaning
  • Magnetic Head - Photolithography
  • Magnetic Head - Wet Etch and Clean
  • Magnetic Head - CMP
  • HGA/HSA Assembly - Cleaning
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