CMP Pad Conditioners and Cleaning Brushes
Tailored pad conditioners and cleaning brushes that enable CMP technologies.
Chemical mechanical planarization (CMP) is used to polish wafer surfaces between layers of material deposition. As semiconductor nodes shrink and chip architectures become increasingly more complex, CMP continues to evolve and gain in critical importance. We use a holistic approach in our development of CMP pad conditioners and cleaning brushes to deliver industry-leading innovation that enhances yield and process stability. Our portfolio of Planargem® XT pad conditioners deliver long life, highly uniform pad conditioning while our Planarcore® PVA brushes provide superior performance and wafer-to-wafer uniformity in post-CMP wafer cleaning applications.
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Yield Advantages Through Maintaining and Upgrading FOUP Populations
Featured Information
Yield Advantages Through Maintaining and Upgrading FOUP Populations
Featured Information
Yield Advantages Through Maintaining and Upgrading FOUP Populations
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Showing 3 Products
Micro-machined SiC substrate with conformal CVD diamond coating delivers long-life, highly uniform pad conditioning while minimizing substrate damage
Conditioner Aggressiveness
Industry
- Mild
- Moderate
- Aggressive
- 5 um/hr
- 12 um/hr
- 20 um/hr
- 40 um/hr
- Semiconductor
- CMP
Rapid changeout and high performance for the most critical post CMP clean applications
Brand Name
- Planarcore®
- Applied Materials Reflexion®
- Applied Materials Mirra Mesa®
- EBARA F-REX300
- Lam Research OnTrak® series
- NH4OH
- H2O2
- 200 mm
- 300 mm
Micro-machined SiC substrate delivers long life, highly uniform pad conditioning while minimizing substrate damage
Brand Name
- Planargem®
- Pad conditioner
- Semiconductor
- Data Storage
- CMP
- Glass disk polishing
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