Tailored pad conditioners and cleaning brushes that enable CMP technologies.
Chemical mechanical planarization (CMP) is used to polish wafer surfaces between layers of material deposition. As semiconductor nodes shrink and chip architectures become increasingly more complex, CMP continues to evolve and gain in critical importance. We use a holistic approach in our development of CMP pad conditioners and cleaning brushes to deliver industry-leading innovation that enhances yield and process stability. Our portfolio of Planargem® XT pad conditioners deliver long life, highly uniform pad conditioning while our Planarcore® PVA brushes provide superior performance and wafer-to-wafer uniformity in post-CMP wafer cleaning applications.