CMP Pad Conditioners
Planargem® CMP pad conditioners offer leading-edge, customer-tailored performance across all aspects of the CMP process. They ensure a consistent wafer removal rate, extend pad and conditioner life, and improve disc-to-disc uniformity.
With over 50 years of experience in advanced wafer handling and transport, Entegris continues to provide safe and reliable 200 mm wafer processing solutions.
From SMIF pods with superior minienvironment control, to wafer process carriers for wet chemical processing, to advanced transport carriers for automated handling and secure storage boxes, we have solutions to meet your specific wafer handling requirements.
Our FOUPs (front-opening unified pods) hold 300 mm wafers safely and securely while they are transported and transferred within the fab as they move through hundreds of sophisticated process steps. Designed to address not only particles but to also minimize and control VOC, oxygen, and relative humidity (RH), our FOUPs provide superior microenvironment control, optimum automation integration, and low cost of ownership.
Chemical mechanical planarization (CMP) is used to polish wafer surfaces between layers of material deposition. As semiconductor nodes shrink and chip architectures become increasingly more complex, CMP continues to evolve and gain in critical importance. We use a holistic approach in our development of CMP pad conditioners and cleaning brushes to deliver industry-leading innovation that enhances yield and process stability. Our portfolio of Planargem® XT pad conditioners deliver long life, highly uniform pad conditioning while our Planarcore® PVA brushes provide superior performance and wafer-to-wafer uniformity in post-CMP wafer cleaning applications.