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CMP Pad Conditioners

Application-tuned performance delivers precise and consistent pad surface morphology and material removal rate

Planargem® CMP pad conditioners offer leading-edge, customer-tailored performance across all aspects of the CMP process. They ensure a consistent wafer removal rate, extend pad and conditioner life, and improve disc-to-disc uniformity.

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  • Cut Rate
  • Industry
Planargem® CMP Pad Conditioner
Planargem® CMP Pad Conditioner
Planargem® CMP Pad Conditioner
Micro-machined SiC substrate with conformal CVD diamond coating delivers long-life, highly uniform pad conditioning while minimizing substrate damage
Conditioner Aggressiveness
  • Mild
  • Moderate
  • Aggressive
 Cut Rate
  • 5 um/hr
  • 12 um/hr
  • 20 um/hr
  • 40 um/hr
  • 60 um/hr
  • ~75 um/hr
 Industry
  • Semiconductor
 Process
  • CMP
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Product information for 200 Series Wafer Transport Carriers, 200 mm Process Wafer Carriers, 198 and 192 Wafer Transport Carriers, and 200 mm Storage Boxes can be found on wafercare.com, until our content migration is complete.

 
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