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CMP Pad Conditioners

Application-tuned performance delivers precise and consistent pad surface morphology and material removal rate

Planargem® CMP pad conditioners offer leading-edge, customer-tailored performance across all aspects of the CMP process. They ensure a consistent wafer removal rate, extend pad and conditioner life, and improve disc-to-disc uniformity.

50 Years Strong!

Feb. 3, 2017

Corporate Fact Sheet
Download PDF 47.4 kB
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  • Cut Rate
  • Industry
Planargem® CMP Pad Conditioner
Planargem® CMP Pad Conditioner
Planargem® CMP Pad Conditioner
Micro-machined SiC substrate with conformal CVD diamond coating delivers long-life, highly uniform pad conditioning while minimizing substrate damage
Conditioner Aggressiveness
  • Mild
  • Moderate
  • Aggressive
 Cut Rate
  • 5 um/hr
  • 12 um/hr
  • 20 um/hr
  • 40 um/hr
  • 60 um/hr
  • ~75 um/hr
 Industry
  • Semiconductor
 Process
  • CMP
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