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CMP Pad Conditioners

Application-tuned performance delivers precise and consistent pad surface morphology and material removal rate

Planargem® CMP pad conditioners offer leading-edge, customer-tailored performance across all aspects of the CMP process. They ensure a consistent wafer removal rate, extend pad and conditioner life, and improve disc-to-disc uniformity.

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  • Cut Rate
  • Industry
Planargem® CMP Pad Conditioner
Planargem® CMP Pad Conditioner
Planargem® CMP Pad Conditioner
Micro-machined SiC substrate with conformal CVD diamond coating delivers long-life, highly uniform pad conditioning while minimizing substrate damage
Conditioner Aggressiveness
  • Mild
  • Moderate
  • Aggressive
 Cut Rate
  • 5 um/hr
  • 12 um/hr
  • 20 um/hr
  • 40 um/hr
  • 60 um/hr
  • ~75 um/hr
 Industry
  • Semiconductor
 Process
  • CMP
Related Product Categories
200 mm Wafer Processing

With over 50 years of experience in advanced wafer handling and transport, Entegris continues to provide safe and reliable 200 mm wafer processing solutions.

Product information for 200 Series Wafer Transport Carriers, 200 mm Process Wafer Carriers, 198 and 192 Wafer Transport Carriers, and 200 mm Storage Boxes can be found on wafercare.com, until our content migration is complete.

 
300 mm Front Opening Unified Pods (FOUPs)

Safely transport, store and protect 300 mm wafers with our line of front-opening unified pods (FOUPs).
200 mm Accessories

Optimize the cleanliness and performance of your A200 and M200 wafer microenvironments with E200 door assemblies, replacement gaskets, handles, door seal kits, and more. 
Chucks

Our chuck solutions use innovative coating technologies which make for a very flat surface that prevents metal contamination, reduces particles and is durable to last millions of wafer cycles. 
Post-CMP Cleaning Brushes

Planarcore® PVA Brushes are designed to deliver superior performance and wafer-to-wafer uniformity in post CMP wafer cleaning applications.
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