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Showing 10 of 107 results for Spray
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Showing 10 of 107 results for Spray
Spray nozzles with a flare connection are ideal in applications where a threaded connection is not desired
Type
- Nozzles
- Semiconductor
- LED
- Flat Panel Display
- Wet Etch and Clean
- Substrate Cleaning
- Substrate - IPA
- Substrate - Polishing
Threaded spray nozzles for use in any ultrapure or chemically corrosive application
Orifice
- N/A
- Nozzles
- Semiconductor
- LED
- Flat Panel Display
- Wet Etch and Clean
- Substrate Cleaning
- Substrate - IPA
- Substrate - Polishing
Long-lasting, reliable PFA DI water spray guns with 1/4" and 1/2" FNPT inlet connections
Connection
- 1/4" FNPT
- 1/2" FNPT
- N/A
- 552 kPa (80 psig)
- PFA and PTFE wetted parts
Long-lasting, reliable Nitrogen spray guns for use in high purity, chemically corrosive applications
Connection
- 1/4" FNPT
- 0.5 µm PTFE membrane
- 517 kPa (75 psig)
- PFA
- PTFE and PE wetted parts
Prevent stagnant water and bacteria growth in your valuable process with our recirculating DI water spray guns
Connection
- 3/8" Flaretek® tube fitting or 1/2" compression
- N/A
- 552 kPa (80 psig)
- PFA wetted parts
Find numerous accessories and replacement parts for our nitrogen, DI water and recirculating DI water spray guns.
The protective cover safeguards Integra® valves while in service with wet environments or during spray down applications
Accessory Type
- Position indicator cover
We offer high purity, chemically inert Cynergy® dip tubes that withstand corrosive chemicals, reduce maintenance costs and minimize spills across a wide range of temperatures and chemistries.
Industry
- Water Treatment
- Life Sciences
- Clean-in-Place (CIP)
- Chemical Delivery
- Bioprocessing
- Fine Chemicals
Enhance yield on batch wet process stations using our high-flow Trinzik™ PSP dilute process filters
Brand Name
- Trinzik™
- Dilute Acids
- Aqueous Acids
- Detergents
- DI Water
- Point of Tool
- Semiconductor
- Chemical Manufacturing
ST-28M plasma residue remover has been formulated to remove the residues associated with high energy plasma etchers and small geometry devices. ST-28M can be used to remove both organic and inorganic residues, but is especially effective in removing the residues remaining after today’s high temperature O2 ash processes
Interconnect Technology
- Al
- 250, 130, 90, 65
- Semiconductor
- Post CMP