At the heart of every high-performance chip are complex micro-patterns that must remain flawless. But that precision is constantly under threat from chemical impurities, reticle scratches, airborne contaminants, and ESD (electrostatic discharge) damage. Advanced filtration and protective technologies like filters, purifiers, photoresist bottles, photoresist pumps, ESD fluid management and wafer transport, and reticle pods integrate to eliminate harmful particles, organics, metals, and microbubbles, while shielding delicate IC images from physical and molecular damage. Together, they preserve the integrity of each exposure and prevent defects like microbridge and electrical shorts.
Defect Prevention Operational Efficiency Solutions
Chemical Contamination Control
Prevent photochemical wafer defects with ultraclean packaging, dispense, filtration, and purification solutions.
Gas Contamination Control
Prevent gas-borne wafer defects with ambient environment and gas contamination control solutions.
Reticle and Mask Protection
Prevent reticle and pellicle damage in EUV, immersion, and traditional imaging applications.
ESD Fluid Management
Remove dissipative charge with continuously conductive polymers in flammable solvent and other non-conductive electronics-grade chemical applications.
ESD Grounding Straps
Increase operator safety with grounding strap solutions in flammable solvent and other non-conductive electronics-grade chemical applications.
ESD Wafer Handling
Ensure superior microenvironment control, optimum automation integration, and low cost of ownership in ESD-sensitive wafer transport applications.
EUV Reticle Protection
EUV pods protect the reticle during use, storage, and transportation while not introducing additional contamination or damage in a clean, dry atmosphere.