Chuck Cleaning Wafer (CCW)
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ESC (Electrostatic chuck) applications
Dry Etch Application
The CCW removes particles and process debris from the ESC that can cause helium backside leaks. This can be done without opening the process chamber for a wet clean, reducing downtime from > 8 hours to a few minutes.
PVD Application
The CCW removes particles and process debris from the ESC that can cause backside pressure faults. This can be done without opening the process chamber, reducing downtime for cleaning from > 12 hours to a few minutes.
Vacuum chuck applications
Lithography Application
The CCW removes particles and process debris that cause focus faults on the vacuum chuck. This can be done without opening the tool, reducing downtime from > 1 hour to a few minutes.
Prober Chuck and Metrology Applications (Wafer Test)
The CCW removes particles and process debris on the prober chuck that can damage or contaminate product wafers. This can be done without opening the tool, reducing downtime especially for high- or low-temperature testing.
仕様書
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