コンタミネーション コントロール
加工寸法の微細化と3D構造の急増により、半導体製造工場での汚染管理は、許容可能なデバイスの歩留まりを達成するために不可欠となっています。プロセスライフサイクルを全体を通して、エア、バルクガス、特殊ガス、および薬品の高度なろ過と精製が、欠陥を減少させ、歩留まりを向上させるための重要な要素となってきました。半導体製造メーカーは、受け入れる薬品やガスごとに許容できる粒子、金属、有機物などの限界値の仕様をますます厳しくしています。
粒子、ゲル、金属、空気中の分子状汚染物質 (AMC) はすべて、さまざまな形で製品、プロセス、装置に影響を与え、製品の欠陥につながります。液体用フィルターとピューリファイヤーは、欠陥の原因となる汚染物質がウェーハや基板に到達するのを防ぎます。インテグリスには、ユースポイント、バルク、チャンバー、ウェーハ、クリーンルーム、装置のいずれにおいても、液体、ガス、エアの先進的なろ過・精製のソリューションを提供し、あらゆるテクノロジーノードにおいてお客様の生産性と信頼性の要件に応えてきた長い歴史があります。
薬品製造における純度との戦い
The digital transformation we are all experiencing as consumers present new challenges to material makers, as well as opportunities. Contamination control remains one of the largest challenges as integrated circuit (IC) technology advances. Better contamination control can significantly improve yield, and a one percent yield improvement can mean up to $150 million per year in net profit.
Bridging the Filtration Gap Using an Empirical Model
Ashutosh Bhabhe, Senior Engineer, Liquid Filtration Applications, discusses how our empirical model, which combines fundamental chemical engineering with Entegris' knowledge, is helping bulk chemical suppliers choose the right advanced filter to maintain purity. And Siddarth Sampath, Applications Engineer, Liquid Purification and Metrology, explains using this model, which uses flow rate and retention attributes, to predict metal removal behavior in solvents to help provide optimized filtration throughout the supply chain.
Runtime: 02:59
Featured Insights
Explore solutions to the gas purity challenges faced by semiconductor manufacturers.
Lithographers in semiconductor manufacturing are tasked with the challenge of creating circuit patterns that meet production yield, parametric performance, and long-term reliability requirements in the electronic devices our digital lives depend upon. To do this, predicting and controlling variables in the manufacturing systems, materials, and processes are critical.
The lithographer’s toolkit provides a practical guide to reduce process variations that threaten your semiconductor fab performance.
To enable the effective manufacturing of electronic devices for the Fourth Industrial Revolution, fabs (integrated circuit manufacturers) are challenged with producing denser and more complex chips with smaller line spacing and 3D features. The digital transformation we are all experiencing as consumers present new challenges to material makers, as well as opportunities. Contamination control remains one of the largest challenges as integrated circuit (IC) technology advances.
EUV reticle pods are highly specialized pieces of equipment that fulfill a critical role in EUV lithography. They must protect the reticle during use, storage, and transportation while not introducing additional contamination or damage.
Control of airborne molecular contaminants (AMC) enable manufacturers of integrated circuits (IC) to improve their production yield and further assure the integrity of electronic devices. Contaminant removal is achieved with AMC filters throughout the fab environment and at the tool locations.