Enabling Advanced Lithography (EUV)
The sustained pursuit of high density in semiconductors for both logic and memory applications has seen the rapid adoption of EUV lithography, and after decades of development, this technology has reached the majority as device manufacturers employ EUV for critical layer patterning at sub-7 nm nodes. To maintain the scaling roadmap that EUV affords, innovation in defectivity mitigation strategies is critical.Entegris’ expertise in materials science, contamination control, and defect-free delivery allows us to partner on the most complex defect challenges facing the industry.
Extreme Ultraviolet reticle pods are highly-specialized pieces of equipment that fulfill a critical role in EUV lithography. They must protect the reticle during use, storage, and transportation while not introducing additional contamination or damage. Pods must be compatible with lithography equipment and be able to maintain a clean, dry atmosphere for the reticle. Precisely designed dual-pod configurations achieve these goals for reticles both with and without pellicles, ensuring the future of EUV lithography.