Enabling Advanced Lithography (EUV)
The sustained pursuit of high density in semiconductors for both logic and memory applications has seen the rapid adoption of EUV lithography, and after decades of development, this technology has reached the majority as device manufacturers employ EUV for critical layer patterning at sub-7 nm nodes. To maintain the scaling roadmap that EUV affords, innovation in defectivity mitigation strategies is critical.Entegris’ expertise in materials science, contamination control, and defect-free delivery allows us to partner on the most complex defect challenges facing the industry.
Extreme Ultraviolet reticle pods are highly-specialized pieces of equipment that fulfill a critical role in EUV lithography. They must protect the reticle during use, storage, and transportation while not introducing additional contamination or damage. Pods must be compatible with lithography equipment and be able to maintain a clean, dry atmosphere for the reticle. Precisely designed dual-pod configurations achieve these goals for reticles both with and without pellicles, ensuring the future of EUV lithography.
Featured White Paper
Enabling Advanced Lithography: The Challenges of Storing and Transporting EUV Reticles
This paper explains the challenges inherent in designing pods for EUV lithography and proposes solutions that will allow more fabs to implement advanced lithography nodes at their facilities.
Featured White Paper
EUV Enablement: Solving defect challenges in the EUV process
This white paper explains why specific advances are necessary for the success and expansion of EUV lithography.
Addressing EUV’s Greatest Challenges: Stochastic Defects and High NA Enablement
As device manufacturers employ EUV for critical layer patterning for sub-7 nm nodes in logic, and more recently in DRAM, innovation in defectivity mitigation strategies needs to keep pace to maintain the scaling roadmap that EUV affords. Join us for this webinar addressing:
- The latest technology developments related to EUV implementation
- Mitigation strategies to address both stochastic defects as well as conventional sources of variability
- What is needed to enable high NA and the implications to the scaling roadmap
EUV Enablement: Solving Defect Challenges in the EUV Process
In this webinar, Dr. Wenge Yang discusses the latest technology developments related to EUV implementation and how to reduce defectivity and variability challenges in the EUV process.
EUV Enablement: Solving Defect Challenges
Animation shows why extreme ultraviolet (EUV) lithography is replacing 193 nm immersion (193i) lithography for more and more critical chip layers, and how relying on improved filtration methods can help reduce defects.
Protecting and Transporting Extreme Ultraviolet (EUV) Reticles
Reliable patternmaking at such a fine scale requires ultraclean reticles. We can help you through your challenges of storing and transporting EUV reticles.
Learn more about our EUV lithography solutions
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Advanced extreme ultraviolet light (EUV) reticle pod is designed to provide defect-free protection of EUV reticles enabling the high-volume manufacturing of advanced technology nodes during storage, handling and vacuum-transfer operations.
A first of their kind, Purasol™ solvent purifiers remove a wide variety of metal microcontaminants found in organic solvents used in photoresist applications. Using uniquely tailored membrane technology, these versatile purifiers reduce defects in critical process streams.
Revolutionary membrane technology to remove critical photochemical contaminants by enhancing the native retention mechanisms of each membrane type to match the needs of each chemistry. This technology can be applied to various filters to achieve maximum contaminant removal and increase device performance.
Without introducing unwanted contamination or physical damage, our EUV reticle pods provide safe storage and protection during lithographic patterning, inspection, cleaning, and repair.The dual-pod design offers an inner and outer pod to maintain a contamination-free environment. The EUV pod is compatible with lithography equipment and maintains a clean, dry atmosphere for the reticles both with and without pellicles.
Best-in-class, contamination control solution in advanced photochemical applications. A unique, cage-like morphology membrane reduces on-wafer defectivity while providing sufficient flow and superior filter cleanliness. The polyimide construction offers broad chemical compatibility with photoresist, photochemicals, and acidic chemicals.
IntelliGen® photochemical dispense systems use state-of-the-art, two-stage dispense technology with a built-in Impact® 8G filter manifold to enable independent filtration and dispense. Dispense systems are available for low-, medium-, and high-viscosity fluids. Communication systems enable you to network pumps for efficient process monitoring.
Chemicals can be susceptible to particle contamination that may be introduced during chemical transport or transfer from bulk chemical containers to smaller drums or transportation packs. Mitigate this risk with clean, contamination-controlled NOWPak® liner-based bottle and canister systems that help protect valuable materials throughout filling, transporting, and dispensing operations.
GateKeeper® automatic regeneration gas purification systems remove gaseous contaminants down to the part-per-trillion level. They provide a cost-effective way to manage gas supply purity and prevent contamination in your process without damaging tools.
Control contaminants in the entire fab and protect both process equipment and wafers from the damaging effects of AMC with VaporSorb™ filters. Designed from the ground up for gas-phase contamination removal and low outgassing, these chemically-clean filters enable the latest technology nodes.