Enabling Advanced Lithography (EUV)
As semiconductor geometries grew smaller (sub 14 nm), EUV lithography was developed to successfully scale down complex patterns on wafers for the most advanced technologies.
Extreme Ultraviolet reticle pods are highly-specialized pieces of equipment that fulfill a critical role in EUV lithography. They must protect the reticle during use, storage, and transportation while not introducing additional contamination or damage. Pods must be compatible with lithography equipment and be able to maintain a clean, dry atmosphere for the reticle. Precisely designed dual-pod configurations achieve these goals for reticles both with and without pellicles, ensuring the future of EUV lithography.
LIVE WEBINAR
Addressing EUV’s Greatest Challenges: Stochastic Defects and High NA Enablement
Tuesday, October 12 | 10:00 AM EDT
As device manufacturers employ EUV for critical layer patterning for sub-7 nm nodes in logic, and more recently in DRAM, innovation in defectivity mitigation strategies needs to keep pace to maintain the scaling roadmap that EUV affords. Join us for this webinar addressing:
- The latest technology developments related to EUV implementation
- Mitigation strategies to address both stochastic defects as well as conventional sources of variability
- What is needed to enable high NA and the implications to the scaling roadmap
Featured White Paper
Enabling Advanced Lithography: The Challenges of Storing and Transporting EUV Reticles
This paper explains the challenges inherent in designing pods for EUV lithography and proposes solutions that will allow more fabs to implement advanced lithography nodes at their facilities.
Featured White Paper
EUV Enablement: Solving defect challenges in the EUV process
This white paper explains why specific advances are necessary for the success and expansion of EUV lithography.
Recorded Webinar
EUV Enablement: Solving Defect Challenges in the EUV Process
In this webinar, Dr. Wenge Yang discusses the latest technology developments related to EUV implementation and how to reduce defectivity and variability challenges in the EUV process.
Featured Video
EUV Enablement: Solving Defect Challenges
Animation shows why extreme ultraviolet (EUV) lithography is replacing 193 nm immersion (193i) lithography for more and more critical chip layers, and how relying on improved filtration methods can help reduce defects.
Featured Pictogram
Protecting and Transporting Extreme Ultraviolet (EUV) Reticles
Reliable patternmaking at such a fine scale requires ultraclean reticles. We can help you through your challenges of storing and transporting EUV reticles.
Learn more about our EUV lithography solutions
FIND AN OFFICE LOCATION OR SPEAK WITH AN EXPERT
Contact UsProduct Solution
Advanced extreme ultraviolet light (EUV) reticle pod is designed to provide defect-free protection of EUV reticles enabling the high-volume manufacturing of advanced technology nodes during storage, handling and vacuum-transfer operations.