Test, Assembly and Packaging

As the leading full service provider of backend wafer carrier solutions for SEMI standard, ultra thin, and thick wafers, we optimize your wafer and device testing, assembly and packaging workflow. 

Understanding that finished wafers have the greatest value, our broad product offering provides the utmost protection for the sensitive devices from handling and shipping damage, static events and contamination. In keeping an eye on cost savings enjoy a sizeable savings in transportation costs from maximized packaging density in our horizontal wafer shipping systems that have been successfully integrated to backend automation and wafer handling systems worldwide.

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Considerations for Improving 3D NAND Performances, Reliability, and Yield