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96 Layers and Beyond: Solving 3D NAND material and integration challenges

Listen as Dr. Mark Puttock, senior director, advanced technology engagements, explains how the semiconductor industry is adapting to the 3D NAND memory challenges of extreme high aspect ratio (HAR) processing to scale to 96 layers and beyond, and the need for new chemical precursors and coatings to achieve the critical purity and contamination requirements. Runtime 3:32