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Post CMP Cleaning Solutions

Industry Leading Solutions for Advanced Post CMP Cleaning Needs

Complete range of solutions for the post chemical mechanical planarization (post-CMP) cleaning process.  Solutions offer excellent corrosion control, surface contamination removal and cost of operation performance.

Narrow Your Selection
  • Technology Node (nm)
  • Industry
  • Process
PlanarClean® AG W100 Cleaning Solution
PlanarClean® AG W100 Cleaning Solution
PlanarClean® AG W100 Cleaning Solution
PlanarClean® AG W100 Cleaning Solutions provide one-step, superior cleaning in advanced processes while protecting the underlying thin films and materials. The proprietary formulations offer increased performance through enhanced reliability and yield, low to zero corrosion and defect and increased queue time.
Interconnect Technology
  • W
 Technology Node (nm)
  • 10
  • 7
  • 5
 Industry
  • Semiconductor
 Process
  • Post CMP
ESC 784 Cleaning Solution
ESC 784 Cleaning Solution
ESC 784 Cleaning Solution
ESC 784 is a cost-effective cleaning product specially developed for cleaning hydrophobic surfaces in copper integration processing. This cleaning solution utilizes a high-pH formulation that removes contaminants generated by CMP process, while preventing corrosion of copper substrates.
Interconnect Technology
  • Cu
  • Al
  • WLP
 Technology Node (nm)
  • 130
  • 90
  • 65
  • 45
  • 40
  • 32
  • 28
 Industry
  • Semiconductor
 Process
  • Post CMP
PlanarClean® AG Cleaning Solution
PlanarClean® AG Cleaning Solution
PlanarClean® AG Cleaning Solution
PlanarClean® AG formulated solutions provide superior cleaning in advanced processes while protecting the underlying thin films and materials. The proprietary formulations offer increased performance through enhanced reliability and yield, low to zero corrosion and defects and increased queue time.
Interconnect Technology
  • Cu
  • CO
 Technology Node (nm)
  • 28
  • 20
  • 16
  • 14
  • 10
  • 7
  • 5
 Industry
  • Semiconductor
 Process
  • Post CMP
ESC T794 Cleaning Solution
ESC T794 Cleaning Solution
ESC T794 Cleaning Solution
ESC T794 is a cost-effective cleaning product specially developed for cleaning hydrophobic surfaces in copper integration processing. This cleaning solution utilizes a high-pH formulation that removes contaminants generated by CMP process, while preventing corrosion of copper substrates.
Interconnect Technology
  • Cu
 Technology Node (nm)
  • 130
  • 90
  • 65
  • 45
  • 40
  • 32
  • 28
 Industry
  • Semiconductor
 Process
  • Post CMP
PlanarClean® Cleaning Solution
PlanarClean® Cleaning Solution
PlanarClean® Cleaning Solution
PlanarClean® is the next-generation post-CMP copper cleaning product designed for use following the barrier CMP step. Formulated using our high-productivity testing and development process, PlanarClean comes as an aqueous solution with strong-acting agents that are very effective at preventing copper corrosion during and after the cleaning process.
Interconnect Technology
  • Cu
 Technology Node (nm)
  • 130
  • 90
  • 65
  • 45
  • 40
  • 32
  • 28
  • 20
  • 16/14
  • 10
  • 7
  • 5
 Industry
  • Semiconductor
 Process
  • Post CMP
Related Product Categories
Liquid Filters

Controlling contaminants in process streams is a vital way to improve operating efficiency and enable technology advances. Entegris offers a variety of membrane and media to match the chemical compatibility and process conditions of each manufacturing environment.

Liquid Filter Housings

Liquid filter housings provide a variety of performance and operator safety benefits. Polymer housings are utilzied in higher cleanliness applications and those that are more sensitive to metals leaching into the process materials. 
Process Tool Air Filters

Entegris Tool AMC filters provide superior protection from common AMC in the lab, including acids, bases and organics. Tool AMC filters utilize both standard filtration media and custom media blends to meet various AMC removal requirements.
Tubing and Pipe

Entegris offers PFA PureBond® weldable pipe and a variety of FluoroLine® tube materials, including PFA, for use in highly corrosive applications, and industrial grades for less demanding applications.
Cleanroom Air Filters

Cleanroom filtration utilizes unique chemistry to remove critical contaminants at a lower pressure drop. VaporSorb™ cleanroom chemical filters deliver greater than 95% removal efficiency. Implementation is easy in front/rear access frame banks, side access housing units or ceiling fan units.
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