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SEMICON® Taiwan 2017 Corporate Sep. 13, 2017 - Sep. 15, 2017 Taipei, Taiwan  Taipei Nangang Exhibition Center
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  • Technology Node (nm)
  • Industry
  • Process
PlanarClean® AG-W100 Cleaning Solutions provide one-step, superior cleaning in advanced processes while protecting the underlying thin films and materials. The proprietary formulations offer increased performance through enhanced reliability and yield, low to zero corrosion and defect and increased queue time.
Interconnect Technology
  • W
Technology Node (nm)
  • 10
  • 7
  • 5
Industry
  • Semiconductor
Process
  • Post CMP
PlanarClean® AG formulated solutions provide superior cleaning in advanced processes while protecting the underlying thin films and materials. The proprietary formulations offer increased performance through enhanced reliability and yield, low to zero corrosion and defects and increased queue time.
Interconnect Technology
  • Cu
  • CO
Technology Node (nm)
  • 28
  • 20
  • 16
  • 14
  • 10
  • 7
  • 5
Industry
  • Semiconductor
Process
  • Post CMP
PlanarClean® is the next-generation post-CMP copper cleaning product designed for use following the barrier CMP step. Formulated using our high-productivity testing and development process, PlanarClean comes as an aqueous solution with strong-acting agents that are very effective at preventing copper corrosion during and after the cleaning process.
Interconnect Technology
  • Cu
Technology Node (nm)
  • 130
  • 90
  • 65
  • 45
  • 40
  • 32
  • 28
  • 20
  • 16/14
  • 10
  • 7
  • 5
Industry
  • Semiconductor
Process
  • Post CMP
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