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Chucks

Our chuck solutions use innovative coating technologies which make for a very flat surface that prevents metal contamination, reduces particles and is durable to last millions of wafer cycles. 

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PECVD and PVD Coatings
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PECVD and PVD Coatings
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Narrow Your Selection
  • Industry
  • Process
Chuck Refurbishment
Chuck Refurbishment
Chuck Refurbishment
Custom repair, rebuild and redesign services significantly improve performance and reduce cost of ownership.
Industry
  • Semiconductor
 Process
  • Ion Implant
Electrostatic Chucks
Electrostatic Chucks
Electrostatic Chucks
We design and manufacture high performance electrostatic chuck solutions for advanced semiconductor processes. See specifications.
Industry
  • Semiconductor
 Process
  • Ion Implant
Vacuum Chucks
Vacuum Chucks
Vacuum Chucks
Versatile embossment system offers ultra-flat, robust and reliable wafer contact surface.
Industry
  • Semiconductor
 Process
  • Ion Implant
Related Product Categories
200 mm Wafer Processing

With over 50 years of experience in advanced wafer handling and transport, Entegris continues to provide safe and reliable 200 mm wafer processing solutions.
150 mm Wafer Processing

To support the semiconductor industry's requirements for advanced 150 mm wafer handling, we offer a variety of wafer carriers, handling solutions and accessories that safely transport your silicon wafers.
125 mm Wafer Processing

Reliable wafer carriers and storage boxes that address the automation, contamination, and productivity concerns of today's 125 mm (5") fabs.

150 mm and Smaller Wafer Carrier Accessories

Learn about the numerous wafer carrier handles, wafer retainers, storage box cushions, and traveler envelopes available for use with our 150 mm (6"), 125 mm (5"), and 100 mm (4") wafer storage and handling products.
100 mm Wafer Processing

With over 50 years of experience in advanced wafer handling and transport, Entegris continues to provide 100 mm (4") wafer processing solutions to safely and reliably transport and protect silicon wafers.

300 mm Front Opening Unified Pods (FOUPs)

Our FOUPs (front-opening unified pods) hold 300 mm wafers safely and securely while they are transported and transferred within the fab as they move through hundreds of sophisticated process steps. Designed to address not only particles but to also minimize and control VOC, oxygen, and relative humidity (RH), our FOUPs provide superior microenvironment control, optimum automation integration, and low cost of ownership.
200 mm Accessories

Optimize the cleanliness and performance of your A200 and M200 wafer microenvironments with E200 door assemblies, replacement gaskets, handles, door seal kits, and more. 
Labware

We offer a wide variety of labware products to assist with wafer processing. Learn about our tweezers, tongs, vacuum probes, beakers, funnels strainers, dippers, baskets, trays, and more.
76.2 mm 3" Wafer Processing

With over 50 years of experience in advanced wafer handling and transport, Entegris continues to provide 76.2 mm (3") wafer processing solutions to safely and reliably transport and protect silicon wafers.

2.5" and Smaller Wafer Processing

With over 50 years of experience in advanced wafer handling and transport, Entegris continues to provide 2.5" and smaller wafer processing solutions to safely and reliably transport and protect silicon wafers.

CMP Cleaning Brushes

Our portfolio of Planarcore® PVA brushes delivers superior performance and wafer-to-wafer uniformity in post-CMP wafer cleaning applications.

CMP Pads

Our portfolio of CMP pads provides exact hardness, pore sizes, and compressibility to meet CMP application requirements

Plasma Enhanced Chemical Vapor Deposition (PECVD) Coatings

We specialize in silicon and carbon-based coatings using PECVD processes. Highly compatible to fit your business, deposit coatings can be used on a variety of vacuum compatible substrates including metals, alloys, ceramics, semiconductors and polymers. We can coat chambers that can accommodate different shapes and sized items, up to 31" in diameter.
Caerus™ Coating Technology

Caerus™ family of Aluminum-based Oxide coatings are deposited at low temperatures with superior film quality. Our Caerus coatings are highly conformal, dense, pinhole-free and exhibit homogeneous microstructure. The coatings have excellent adhesion and provide outstanding corrosion and etch resistance properties. They are also characterized by superb electrical voltage stand-off and exceptional trace metal diffusion barrier layer characteristics. 
Pegasus™ Coating Technology

Pegasus™ series coatings are a family of precision-engineered PVD coatings tailored for Fluorine and Chlorine plasma etch applications. Our Pegasus coatings are deposited at low temperatures and can be deposited on aluminum, alumina, stainless steel and other commonly used substrate materials, with superior adhesion. These coatings provide etch resistance, low particle generation, and oxidation resistance.  
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