With over three decades of experience in advanced wafer handling and transport, we’re helping to lead the development and commercialization of 450 mm wafer handing system products. Our products improve yields and increase productivity for device manufacturers as they advance their manufacturing processes.
We specialize in silicon and carbon-based coatings using PECVD processes. Highly compatible to fit your business, deposit coatings can be used on a variety of vacuum compatible substrates including metals, alloys, ceramics, semiconductors and polymers. We can coat chambers that can accommodate different shapes and sized items, up to 31" in diameter.
Caerus™ family of Aluminum-based Oxide coatings are deposited at low temperatures with superior film quality. Our Caerus coatings are highly conformal, dense, pinhole-free and exhibit homogeneous microstructure. The coatings have excellent adhesion and provide outstanding corrosion and etch resistance properties. They are also characterized by superb electrical voltage stand-off and exceptional trace metal diffusion barrier layer characteristics.
Pegasus™ series coatings are a family of precision-engineered PVD coatings tailored for Fluorine and Chlorine plasma etch applications. Our Pegasus coatings are deposited at low temperatures and can be deposited on aluminum, alumina, stainless steel and other commonly used substrate materials, with superior adhesion. These coatings provide etch resistance, low particle generation, and oxidation resistance.