PlanarClean® AG Cleaning Solutions are designed for advanced Cu post-CMP process. The proprietary formulations offer increased performance through enhanced reliability and yield, low to zero corrosion and defects and increased queue time.
Extremely low defectivity
Extremely low etch rate of all major substrates
Extended corrosion prevention Low Cu roughness and organic residues Superior performance even at higher point-of-use dilution
Meets EHS requirements for fab chemistry
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ApplicationsPlanarClean® AG Cleaning Solution Applications