ST-250™ Cu Residue Remover Solution is the industry standard for removing plasma etch residues. It’s specifically formulated for maximum compatibility with copper, advanced barrier layer and etch-stop materials.
Removes difficult plasma etch residues
Highly compatible with low –k dielectrics, copper and advanced barriers
Requires no post-solvent rinse
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Interested in ST-250™ Cleaning Solution?
Contact your Entegris account manager or