200 mm SmartStack® Contactless Horizontal Wafer Shippers
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- Shipping and storing thin 3D, lens or bumped wafers
Specifications
| Wafer size: | 200 mm | |
| Wafer capacity: | 25 | |
| Wafer thickness: | Variable (maximum 1100 micron) | |
| Wafer dimensions: | Length | 8.88” |
| Width | 8.88” | |
| Height | 3.55” | |
| Weight: | 0.709 kg (1.5 lb)* | |
*Includes 26 rings
| Property | Test Method | Units | Typical Values |
| Specific gravity | ASTM D-792 | g/cc | 0.97 |
| Tensile strength | ASTM D-638 | MPa | 33.3 |
| Tensile modulus | ASTM D-638 | MPa | 2,207 |
| Tensile elongation | ASTM D-638 | percent | 9.7 |
| Flexural modulus | ASTM D-790 | MPa | 2,069 |
| Notched izod | ASTM D-256 | J/m | 42.4 |
| Unnotched izod | ASTM D-256 | J/m | 742 |
| Volume resistivity | ASTM D-257 | ohms-cm | 101-103 |
| Surface resistivity | ASTM D-257 | ohms/sq. | 103-108 |
Successfully Opted for software Updates
| Part Number | Product Type |
|---|---|
| HWS200C-101-61C02M | Shipper |
| HWS200C-1PK-KIT | Shipper kit |
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