Probe Card Clean (PCC)
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Product Information
Probe Polish® (PP70, PP99, PP150)
Probe Polish® removes embedded contamination from probe tips and collects loose debris generated during probing. Multiple grit size and concentration of grit varies depending on different probe types of customer.
Probe Polish® WFL3.0.1™
Probe Polish® WFL3.0™ provides functionalized cleaning to maximum performance, features with regular pattern such as waffle. Cleaning executed on WFL functionalized features produces an efficient cleaning action on the probe tip and sides.
Probe Lap®
Probe Lap is an abrasive film with a controlled surface roughness built with aluminum-oxide or silicon-carbide particles. It is specifically designed for on-line and off-line probe cleaning across a -55C to 200C.
LCxK
LC4K, LC6K, LC8K and LC10K abrasive coated foam materials were been developed with a low chlorine content. The low-chlorine content minimizes risks of intermetallic chlorine corrosion due to ions transferred during probe cleaning.
Probe Form®
Probe Form® provides a cost-effective method of aggressive off-line cleaning or uniformly “reforming” various probe tips. The highly crosslinked, non-corrosive polymer is designed to remove probe material.
Probe Vertical™
Probe Vertical™ is designed to remove embedded and bonded debris from pointed probe tips and collect any loose debris that was generated during probing. The cleaning motion with Probe Vertical is only in the Z direction.
Probe Clean®
Probe Clean® removes loose contamination and adherent debris from probe tips during probing. It can be extended probe card life time with no abrasive removal.
Probe Scrub®
Probe Scrub® removes embedded and bonded debris from the probe contact area and collects loose debris from the tip length. It is well-suited for cleaning cantilevered probe cards at temperatures of -40C to 125°C.
Probe Refresh™
Probe Refresh™ is an abrasive film with controlled surface roughness compliant underlayers that effectively reduce probe wear. It is an effective direct replacement for similar on-line lapping film applications.
Fiber Film
Fiber Film provide cost effective methods of uniformly "forming" and "reforming" probe tip geometries. In offline cleaning materials have performance for effective and efficient tip shaping, recovery and maintenance.
Assembly Clean®
Assembly Clean® is a high-tack polymer designed to remove various adherent debris from pick and place hardware during IC device assembly. Removal of strongly adherent debris requires an abrasive polymer.
Heat Conducting Wafer (HCW)™
HCW™ is a 300mm SEMI-standard wafer with a stable, heat-conducting polymer applied onto the surface. Advanced memory probe-cards are brought in contact with the surface during prober idle time or after a probe card change in order to accelerate temperature stabilization.
- Semiconductor manufacturing