- Fadi Coder | Director, global applications
Join Us | Live Webinar
Tuesday, May 25 - 2:00PM EST | 11:00 AM PST
The first steps in fabricating SiC wafers involve grinding, lapping, and polishing the wafers to create the necessary surface properties before depositing active layers. The slurries used to carry out these steps, therefore, are becoming more critical.
In this webinar, you will learn about:
- The challenges specific to SiC polishing process
- Slurry performance improvement to address new technical challenges including increasing removal throughput, eliminating scratches, and low cost of ownership
- The benefits of offering an encompassing synergetic solution to improve yield