View Webinar Series
Register Now!
CMP Technology Day Virtual Series will provide more insight on:
- Wafer surface management for better process performance and stability
- Contamination control for reduced defectivity
- Precision monitoring for higher yields and greater process efficiency
Register to view the Episode(s) of your choice below.
Episode 1: Wafer surface management for better process performance and stability
RECORDED
Decreasing wafer defectivity with Planargem® pad conditioners and Planarcore® PVA brushes
Formulation characteristics for proper post-CMP cleaning and cost efficiency
Fadi Coder, director global applications - CMP
Episode 2: Contamination control for reduced defectivity
RECORDED
Joining forces in R&D – an introduction to our collaboration efforts to improve defectivity in CMP
Catherine Euvrard-Colnat, CMP R&D manager – CEA-Leti
Silvio Del Monaco, senior staff engineer – STMicroelectronics
Particle size and count analysis of slurries from lab to line
Mark Bumiller, technology manager - Advanced Materials Handling
Optimizing CMP slurry filtration for performance and cost of ownership
Dr. Günter Haas, technologist EMEA – Liquid Microcontamination Control
Episode 3: Precision monitoring for higher yields and greater process efficiency
RECORDED
Real-time monitoring for greater CMP process efficiency
Shane Collis, technologist EMEA - Components and Systems
Precision concentration monitoring for higher yields in CMP and formulated cleaning processes
Joe Evans, business manager
LEARN MORE
Sign up for Zero Defects, our quarterly newsletter dedicated to sharing our latest solutions designed to address your toughest challenges.