Join Us
Entegris’ ICPT 2026 presentations highlight innovations across CMP slurries, pads, filtration, and process chemistry, demonstrating how advanced materials and engineering can improve polishing performance, selectivity, defect control, and manufacturing efficiency for next-generation semiconductor devices.
Featured Presentations
New Particle and Chemistry Technology for Metals IC CMP Slurries
Authors: Yu Yu Chou, Howl Hsu, Brian Reiss, Na Zhang, Entegris
This presentation highlights new particle and chemistry technologies designed to meet the growing performance demands of advanced metals IC CMP, including throughput, defectivity, uniformity, and topography control. The work focuses on polishing challenges for emerging interconnect metals such as molybdenum, which has a narrower passivation window and higher corrosion propensity than tungsten. Attendees will learn how Entegris is developing new inhibitor technology and co-designed particle systems to improve molybdenum corrosion control, selectivity, and chemical compatibility in advanced metal CMP slurries.
Technical Posters
Interfacial Kinetics for Development of Structure-Activity Relationships
Authors: Ali Jawaid, Jason Seabold, Kelvin Li, Entegris
This poster explores how predictive statistical tools and interfacial kinetic modeling can advance formulation design for IC CMP slurries and cleans. By studying adsorption and diffusion kinetics at the liquid/film interface, the work provides insight into the behavior of topography control agents in metals CMP, including tungsten and molybdenum applications. Attendees will learn how kinetic models can support structure-activity relationships and improve understanding of CMP phenomena such as metal corrosion, planarization, and pattern topography control.
New Ceria CMP Slurry Designs for High Throughput Selective Metal TSV Applications
Authors: Wei Hisn “Howl” Hsu, Mason Liu, Long Dai Lu, Entegris
This poster presents new ceria CMP slurry designs for high-throughput selective metal TSV applications. While ceria slurries are known for high dielectric removal capability, their use in metals CMP has historically been limited by chemical compatibility issues with oxidants such as hydrogen peroxide. The work shows how new stabilizing and rate-control technologies can extend slurry pot life while increasing metal removal rates, offering a pathway to improved TSV CMP performance.
Breakthrough CMP Pad Designs: New Surface Textures for Advanced IC
Authors: Rachel Ma, Jessica Lindsay, Weisi Li, Kevin P. Dockery, Aaron Peterson, Entegris
This poster presents Entegris’ new proprietary thermoset polyurethane CMP pad designs, which enable advanced control of pad surface textures for IC CMP applications. The work shows how material-driven pad design can improve polishing performance, including throughput and topography, while reducing dependence on conventional conditioning. Attendees will see how tunable pad textures can help address application-specific CMP requirements, from rougher asperity-rich surfaces to more uniform, finely distributed surface textures.
Selectivity Control in IC Slurry Design for Advanced Packaging
Authors: Francis Acquaye, Sudeep Kuttiatoor, Jay Chang, Alexander W. Hains, Entegris
This poster highlights Entegris’ approach to tuning CMP slurry performance for advanced packaging applications through controlled A-pack and B-pack mixing ratios. The study demonstrates how slurry formulation adjustments can deliver oxide auto-stop behavior, high oxide pattern removal rates, and tunable selectivity toward Cu and SiN surfaces. Attendees will see how this flexible slurry design strategy can help address selectivity, oxide removal, and process control challenges in advanced packaging CMP.
From Lab to Fab: Comparative Study of CMP Filtration Requirements in FEOL and Advanced Packaging Processes
Authors: Chloe “Ting-Chen” Chen, Alex Chuang, Mott Chien, Hager Yeh, Jason Fu, YiWei Lu, Entegris
This poster compares CMP filtration requirements for FEOL and advanced packaging processes, where heterogeneous materials, large surface topography, and complex slurry formulations create new filtration challenges. The study examines factors such as particle characteristics, pH variation, additive interactions, shear force, and idle-time behavior, showing that filtration effectiveness depends on more than pore size alone. Attendees will see how optimized filtration configurations can improve particle retention while maintaining stable pressure and slurry stability, providing a practical framework for CMP filtration optimization across varying formulation conditions.
Next Generation Fine Particle Count Reduction Filter
Authors: Henry (Yu-Heng) Cheng, Yuxin Li, Alan Chao, Enzo Chen, Howard Shih, Aiden Chang, Ying Qi, and Henry Wang, Entegris
This technical poster presents a next-generation CMP filter designed to preferentially reduce fine particles while preserving the slurry’s working particle population. The new filtration media demonstrated significantly improved fine particle reduction compared with the previous product while maintaining comparable large particle reduction.