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Keynote Presentation
Materials Challenges for the Semiconductor Industry
Wednesday, June 3, 8:15-9:05 a.m.
As devices get smaller and smaller, the challenges of physical geometry push existing materials to their limits. Right now, materials such as tungsten experience massive resistivity at smaller dimensions, which
means that chipmakers must look for replacements. But replacing a single material can have cascading effects on the entire manufacturing process. During this keynote, you’ll learn more about this and other obstacles for semiconductor manufacturers, and how partners like Entegris are working up and down the supply chain to help producers create breakthrough solutions.
About the Presenter
Dr. James A. O’Neill, Senior VP and CTO, Entegris
Jim has been our senior vice president and chief technology officer since September 2015. He is responsible for the innovation process within the company including the development of new products. He also manages
the global technology centers where Entegris collaborates with customers – leading semiconductor manufacturers – to solve their most complex technology challenges.
Jim joined Entegris in 2014 as part of our acquisition of ATMI, where he was senior vice president of Electronic Materials. Prior to that, he worked at IBM for 23 years where he held several technical and leadership roles in semiconductor research, development, and manufacturing. In one of those assignments, Jim set up and ran IBM's research operation at Albany Nanotech from 2007 to 2010, focusing on the development of IBM's 14 nm node technology.
Jim earned a doctorate in physical chemistry at Columbia University and a Bachelor of Science degree in chemistry from Yale University. He holds 19 U.S. patents and has 46 technical publications.
Featured Poster Presentation
Wednesday, June 5
5:30-8:00
Poster Session and Conference Reception
P24. Mechanistic and Performance Aspects for Co-designed Process Technology to Enable Mo as the Next Generation Conductor
Presented by: Michael White, Sr. Science Fellow
PVD and CVD molybdenum (Mo) wafers/coupons were prepared and analyzed by various techniques including XPS, electrochemistry, impedance spectroscopy, AFM, Zeta Potential, Raman as well as ATR FTIR spectroscopies. The surface chemistry was then correlated with performance parameters such as the static etch and polishing rates/profile in addition to the defectivity after Planarcore® brush cleaning using with Entegris ML slurries and AG-Mo series PCMP cleaners.
Event Related Content
Migrating to Molybdenum: Comprehensive IC Solutions to Streamline the Transition
The need for smaller dimensions, alongside increasing device performance requirements, is driving the move to new metals for advanced logic and memory. The industry is evaluating lower-resistance and barrierless material alternatives. In this white paper, learn how experienced suppliers can help ease the transition.