Join Us | BOOTH M0148, HALL 1, 4F
Visit the Entegris booth at SEMICON Taiwan and discover how we help the world’s leading chipmakers increase yields and lower defectivity. We offer global R&D facilities, local manufacturing, and solutions that cover the entire fabrication process. With a vast portfolio of products and solutions that can be tailored for your specific requirements, there’s no better partner when it comes to delivering your innovations to the mass market.
FEATURED PRESENTATION
Materials Innovations Enabling Logic Technology
September 5, 11:25 – 11:45 a.m.
701AB (Future Stage), 7F, Taipei Nangang Exhibition Center Hall 2
As semiconductor manufacturers begin introducing barrierless metals such as molybdenum (Mo), they’re discovering that integration requirements go beyond the need for ultra-high purity precursors. Join this presentation and learn about Entegris’ recent efforts to create more predictable unit process interactions. These have resulted in tailored chemical mechanical planarization (CMP) and post-CMP cleaning solutions that react more predictably with Mo etch and deposition. By helping to create a more robust module, we can ensure that chipmakers get new materials to market faster, with lower defectivity and higher yields.
ABOUT THE ENTEGRIS PRESENTER
Paul Besser, Ph.D., Senior Director of Advanced Technology Engagements, Office of the CTO, Entegris
As a senior director in the advanced technology engagement team at Entegris, Dr. Paul Besser is responsible for developing the corporate technology roadmap and engagement strategy for semiconductor logic technology.
Paul’s career began at AMD, where he developed novel materials innovations. He became an AMD Fellow and began accepting assignments at IMEC, Motorola and IBM Research. Since departing AMD, Paul has heldtechnology leadership roles at Unity Semiconductor, GlobalFoundries, Lam Research, and ARM.
Paul holds a Ph.D. in Materials Science and Engineering from Stanford University, has co-authored over 100 research publications, holds over 250 U.S. patents, and was the 2016 inductee to the Engineering Hall of Fame at North Carolina State University.
Event Related Content
Accelerating Speed-to-Yield with High-Purity Materials Solutions
Visit our industry insights page to learn more about how Entegris supports semiconductor manufacturers in their drive to commercialize new innovations. Each new material requires altered process steps, which is why we carefully analyze each step to address unexpected interactions.
