SEMICON Taiwan draws in players from the heart of the global semiconductor industry because it’s the best way to stay up to date on massive trends propelling the field. This year will highlight the industry’s most critical topics including AI chips, advanced packaging, 3DIC, chiplets, FOPLP, heterogeneous integration, silicon photonics, quantum computing, and HBM. The exhibition will also cover vital issues such as supply chain resilience, green manufacturing, geopolitical challenges, and talent development, showcasing Taiwan’s strategic role and leadership in the global semiconductor value chain.
SEMICON Taiwan draws in players from the heart of the global semiconductor industry because it’s the best way to stay up to date on massive trends propelling the field. This year will highlight the industry’s most critical topics including AI chips, advanced packaging, 3DIC, chiplets, FOPLP, heterogeneous integration, silicon photonics, quantum computing, and HBM. The exhibition will also cover vital issues such as supply chain resilience, green manufacturing, geopolitical challenges, and talent development, showcasing Taiwan’s strategic role and leadership in the global semiconductor value chain.
/content/entegris-live/en/home/about-us/events/semicon-taiwan-2025Join Us | BOOTH M0142, HALL 1
Visit the Entegris booth at SEMICON Taiwan and discover how we help the world’s leading chipmakers increase yields and lower defectivity. Our global R&D and local manufacturing capabilities cover the entire fabrication process. With a vast portfolio of products and solutions that can be tailored for your specific requirements, there’s no better partner when it comes to delivering your innovations to the mass market.
FEATURED PRESENTATION
September 11, 2:50 - 3:10 p.m.
Materials Innovations Enabling the AI Era
701AB (Future Stage), 7F, Taipei Nangang Exhibition Center Hall 2
Historically, semiconductor device performance has primarily been driven by physical scaling, device design, and new materials. In the past decade, the industry has observed material innovations are having the greatest relative impact on device performance. The integration of these new materials, such as novel photoresists, interconnect metals and alloys, ultrapure polymers, chemically modified polymer membranes, and formulated chemicals, into the chip fabrication increases process complexity and makes yield ramps more challenging. With more process steps in the overall device build, speed to yield and process integrity are more critical than ever to achieve technology qualification schedules.
This presentation will focus on Entegris’ disruptive approach to accelerating materials innovation by leveraging atomistic modeling coupled with advanced AI models for molecular discovery and materials prediction. We will also highlight how the use of virtual engineering coupled with advanced Design for Additive Manufacturing (DfAM) techniques are used to generate the next generation of 3D printed product solutions.
Register prior to August 20th to enjoy a 20% Early Bird discount
ABOUT THE ENTEGRIS PRESENTER
Montray C. Leavy , Ph.D., Vice President, Chief Technology and Innovation Strategist
Dr. Leavy is the Chief Technology and Innovation Strategist at Entegris, based in Singapore. He leads the Advanced Technology Engagement team responsible for cross-divisional strategy. In this role he plans and executes technical collaborative customer engagements for their most challenging applications while ensuring alignment to Entegris’ product portfolio. His team also identifies and implements next generation technologies and capabilities for the company.
Prior to this role, Dr. Leavy served as Vice President of the Strategic Account Technology Management team. In this position, he led a team responsible for strategic new product development and customer technical engagements. Before Entegris acquired ATMI, he served as Vice President of Account Technology at ATMI where he collaborated with customers to research and develop specific and tailored materials solutions for a variety of processes.
Dr. Leavy earned his Ph.D. in Electrochemistry from the University of Mississippi and holds more than 25 patents.