Speaker(s)
- Montray C. Leavy, PhD
Join Us
Featured Presentation
May 29, 1:00 – 1:25 p.m.
Materials Innovation Advancing the Angstrom Era
How can the semiconductor industry tackle the challenge of 500-layer flash memory designs and angstrom-level critical interconnect dimensions? Manufacturers need to think outside of traditional wafer designs and begin incorporating new materials innovations. New materials innovation can disrupt literally every aspect of chip manufacturing, however, which means that manufacturers need expert partnerships in order to speed their designs to market. Join Entegris’ Dr. Montray C. Leavy and learn how we can help chipmakers accelerate integration of novel materials while preserving quality and yield.
About the Entegris Presenter
Montray C. Leavy, PhD Deputy Chief Technology Officer
Dr. Montray Leavy is based in Singapore and leads the advanced technology engagement team responsible for cross-divisional strategy. In this role he plans and executes technical collaborative customer engagements for their most challenging applications while ensuring alignment to Entegris’ product portfolio. His team also identifies and implements next generation technologies and capabilities for the company.
Dr. Leavy joined Entegris in 2010 as part of our acquisition of ATMI, where he served as vice president of account technology, collaborating with customers to research and develop tailored materials solutions for a variety of processes. Prior to ATMI, Montray was director of process integration and electroplating technology at Touchdown Technologies, a Verigy Company.
Montray earned a Ph.D. in electrochemistry from the University of Mississippi.