Join Us
Learn how Entegris is advancing lithography with innovative filtration and purification solutions that reduce defects and improve process performance. Our experts will share insights that help enable next-generation EUV technologies and higher yields.
Conference Session
February 25 I 10:30 am – 10:50 am PST I Convention Ctr., Grand Ballroom 220A
Particle quantification on EUV inner pods using adhesive and light-scattering tool
Discover a new particle collection and quantification technique for EUV Inner Pods. This method addresses the risk of particles on pod sealing surfaces that could transfer to reticles, impacting lithography, and causing chip defects. We’ll explore how this technique supports R&D and engineering efforts to optimize pod geometry, design, and material choices for improved performance.
Presenter: Chet Steinhagen, Principal Engineer, Chemical Process Engineering
Poster Sessions
February 25 I 5:30 pm – 7:00 pm PST I Convention Ctr., Hall B
A Novel Purifier for Acid-Sensitive Applications: Suppressing Dimerization and Metal Impurities in Solvent Systems
Discover how Entegris' next-generation purifier minimizes metal contamination and suppresses proton-driven dimerization in cyclohexanone (CHN), ensuring stability for EUV photoresist and other acid-sensitive applications.
Presenter: Elmer Lin, Senior Scientist, Solutions Design
Photoresist filtration design advancements for process throughput performance and defect reductions
Learn how Entegris’ next-generation UPE filtration technology captures sub-15 nm contaminants while maintaining high flow rates, delivering superior purity and throughput for advanced lithography processes.
Presenter: Vanessa Su, Application Engineer
Ultra-Clean Nylon Filtration for EUV Underlayer Defect Mitigation at the N2 Node
Discover how optimized Nylon membrane technology reduces particle-induced defects in EUV underlayer (UL) processing, enabling cleaner profiles and improved yield for next-generation lithography.
Presenter: Miura Kozue, Lead Engineer, Solutions Engineering
Point-of-Use UPE Membrane Filter Optimization for EUV Chemically Amplified Photoresist
Learn how Entegris’ latest UPE membrane technology reduces bridging defects in EUV photoresists, supporting high-NA lithography and next-generation semiconductor manufacturing.
Presenter: Alex Holmann, Lead Engineer, Solutions Engineering
EUV dual pod EIP polymer separation to reduce particle generation
As semiconductor nodes shrink, minimizing particle transfer to reticles is critical. Entegris has advanced EUV pod design with the NX Pod, featuring polymer pads that eliminate metal-to-metal contact between base and cover plates. This innovation significantly reduces particle generation over the pod’s lifetime, ensuring superior performance.
Presenter: Caleb Elwell, Principal Engineer, Product Development Engineering