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At SWTest 2026, Entegris will showcase advanced cleaning materials and participate in a joint technical presentation with Texas Instruments and FormFactor. The presentation examines a dual action MEMS cleaning approach designed to address persistent probe contamination challenges while reducing operational costs in wafer level test environments.
Featured Presentation
Tuesday, June 9th, 2:30 pm – 3:30 pm
The Dual Action MEMS Solution: Cleaning Innovation Meets Cost Reduction
This joint presentation introduces Dual Action MEMS, a new cleaning solution for MEMS microcantilever springs, designed to address persistent challenges such as halo debris, debris transfer, and probe card wear. The work demonstrates how localized wear and three dimensional cleaning action improve debris removal efficiency while minimizing probe tip wear. Experimental results show faster probe recovery, extended probe card lifetime, and significant reductions in offline cleaning and overall cost of ownership compared to conventional cleaning materials.
Presenters and Collaborators:
• Kayden Byrd, Texas Instruments
• Dr. Kenneth Boblak, Entegris
• FormFactor Inc.