The integrity of deposited Cu is influenced by the purity of the materials. Integrating high-purity chemical packaging with advanced process monitoring and filtration enables a data-driven approach to reducing yield variances in pattern and via formation.
Cu Plating Defect Prevention Solutions
Ensure electrical performance and prevent voids, delamination, and open/shorts in deposited Cu plating chemical applications with ultraclean packaging, chemical filtration, and dissolved oxygen sensors (DOX).
Alternatives to Glass Packaging
Glass bottles present problems in safety and integrity of the chemistries they contain, particularly for semiconductor fabs manufacturing modern devices. Entegris’ NOWPak liner-based bottle systems provide a safe, cost-effective alternative to glass.