Tackle the most persistent deposition challenges, such as uniformity, organic residues, and metallic contamination through a holistic, engineered approach with Entegris. Our ultra-high-purity precursors and advanced delivery systems are designed to deposit the most advanced materials on wafers while minimizing contamination at every stage through our proprietary filtration, purification, and storage technologies, ensuring consistent material integrity. Our breadth of solutions enables customers to achieve higher yields, fewer defects, and more reliable device performance.
We offer scalable solutions and full lifecycle support—from R&D to high-volume manufacturing. Our end-to-end approach ensures purity, process compatibility, and consistency, making Entegris a strategic partner in driving innovation.
Deposition Solutions
Liquid and Solid Precursors
Achieve ultrapure ALD and CVD film quality.
Precursor Delivery Systems
Optimize precursor utilization and maintain safe and consistent precursor delivery.
Advanced Coatings
Prevent chamber corrosion, extend tool life, and increase process consistency.
Liquid Packaging
Ensure ultraclean Cu plating solutions packaging.
Liquid Filtration
Optimize Cu plating solutions particle removal with liquid filters.
Dissolved Oxygen Sensor
Ensure Cu plating chemical composition integrity with process monitoring solutions.
Gas Contamination Control Solutions
Prevent electrical failures with particle, metal and organic removal solutions.
Smoothing the Transition to Molybdenum (Mo)
How does switching to Mo influence other semiconductor process steps? Collaboration among fabs and suppliers leads to opportunities to optimize processes and prevent defects.