Wet Etch and Clean
Comprehensive solutions for uniform etch and contaminant-free wafer surfaces.
Achieve uniform etch rate performance, control surface roughness, and remove all residues, particles, and other contaminants in your wet etch and clean processes with our advanced cleaning solutions, chemical contamination control, handling, and monitoring solutions. These solutions reduce systemic yield loss and improve chemical efficiency. They also prevent electrostatic discharge (ESD) while protecting sensitive electrical circuits.
Wet Etch and Clean Solutions
Contamination Control Solutions
Prevent wafer defects and increase process uptime with contamination control and chemical composition integrity, packaging, and handling solutions.
Process Optimization Solutions
Ensure precise control and measurement of process fluids in harsh environments and ultrapure applications.
Post-Etch Cleaning
Eliminate surface contamination with post-etch residue and hard mask removal solutions.
ESD Fluid Management
Prevent wafer level ESD defects and ensure operator/facility safety with continuously conductive polymers.
ESD Grounding Straps
Dissipate electrostatic charge to protect wafers and devices and ensure operator/facility safety.
Wafer Handling
Prevent ESD particle generation and accumulation in wafer handling applications.
Targeted Removal of 30% H202 Contaminants
The goal of the study is to understand the contaminants natively present in semiconductor grade hydrogen peroxide (H2O2) utilizing a hybrid metrology approach to recommend the optimized filtration solution.