Holistic Approach to Enabling Device Performance, Yield, and Reliability
Logic devices are getting smaller, and the introduction of 3D architectures that use vertical fins and nanowires in their gate design introduce more complexity to the fabrication process. As technology nodes shrink beyond 10 nm, new materials are required in both FEOL and BEOL processes to enable performance, yield, reliability and cost.
Featured White Paper
A Holistic Approach to Materials Processing for Scaled Devices
This paper focuses on the issues of scaling logic devices as the industry progresses beyond the 7nm process node, and the need for changes in device architecture, feature dimensions, process materials, and fabrication equipment to achieve production goals.
Recorded Webinars
Technology Forum: Acceleration of the Materials Era
Join Entegris SVP and Chief Technology Officer, Jim O’Neill as he discusses:
- Effects of COVID-19 on semiconductor growth
- Increasing materials intensity in the era of materials advancement and putting it all together
This presentation is moderated by Wenge Yang, VP of market strategy and includes live Q&A with Entegris technology experts.
Materials Innovation: Holistic Solutions for Improved Yield and Reliability
Join Entegris’ SVP, CTO, Jim O’Neill in this webinar to learn about:
- Digital transformation and the demand for higher performance chips
- New, purer materials needed to deliver high-yield and long-term reliability
- Holistic materials and handling solutions to enable a new approach to the most challenging yield problems of advanced node technologies.
Featured Video
Holistic Approach to Materials Processing for Scaled Devices
Animation explaining Entegris' holistic approach to enabling performance, yield, and reliability in emerging logic devices, including innovations in specialty materials for R&D and production, delivery and storage systems, material purity and wafer cleanliness, environmental purity, and finished wafer protection. Runtime: 01:50
Featured Pictograms
Entegris' Holistic Approach to Enabling Device Performance, Yield, and Reliability
Pictorial explaining how Entegris impacts processes across the fabrication floor. Whether it is new metallurgy precursors, effective delivery systems, new cleaning formulations, or new filtration membranes, Entegris offers a holistic solution to your most advanced integration challenges.
Advanced Deposition Materials Innovation at Entegris
With semiconductor nodes shrinking to 10 nm and below and once-flat architectures evolving into complex 3D structures, whole new paradigms in material deposition must be developed. Entegris takes a holistic approach to advanced material development, yielding industry-leading innovation.
Featured Blog Post
How to Approach Materials Processing for Scaled Devices
Logic devices are getting smaller, and the introduction of 3D architectures that use vertical fins and nanowires in their gate design introduce more complexity to the fabrication process. As technology nodes shrink beyond 10 nm, new materials are required in both FEOL and BEOL processes to enable performance, yield, reliability and cost.
Learn more about our holistic approach to enabling device performance, yield, and reliability
Learn more about our holistic approach to enabling device performance, yield, and reliability
Related Topics
Three-dimensional vertically-stacked memory architectures offer exponential gains in flash memory storage, but they also introduce fundamental new challenges at the device fabrication and integration level. These challenges affect all aspects of the flash memory product chain, from design to supply to material handling, manufacturing, and delivery. These challenges become more acute as architectures are pushed from 64 vertical layers to 96, 128, and beyond. We understand many of these challenges and have ideal solutions for them.
In this white paper, we explain the role of precursors in depositing highquality silicon-containing films under a wide range of challenging conditions. Download now.
Materials integration and contamination control remain the largest challenges as wafer technology advances.
In order to produce these high-performing chips at acceptable yields, Entegris’ fab customers rely on newer and purer materials which have the greatest impact on performance and reliability.
Product Solutions
The ProE-Vap® 200 delivery system is designed for solid precursors used in Atomic Layer Deposition (ALD) and Chemical Vapor Deposition (CVD) processes. It provides a stable mass flux for a wide variety of solid materials used for current and future technology nodes. Solid precursors are difficult to deliver consistently into deposition chambers due to their low vapor pressure and limited thermal stability. The ProE-Vap 200 system overcomes these problems and offers a solution that is unmatched in the industry.
PlanarClean® is a post-CMP copper cleaning product designed for use following the barrier CMP step. PlanarClean comes as an aqueous solution with strong-acting agents that are very effective at preventing copper corrosion during and after the cleaning process.