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Industry Insights    

If you want a unique and clear point of view on topics that are driving the industry, look no further.  Whether it’s challenges in 3D NAND manufacturing or the impact of IoT on the industry, Entegris experts are here to share their perspective.

3D NAND Solutions

Three-dimensional vertically-stacked memory architectures offer exponential gains in flash memory storage, but they also introduce fundamental new challenges at the device fabrication and integration level. We understand many of these challenges and have ideal solutions for them.

Clean Chemical Delivery

As logic devices go to smaller line widths, 3D NAND architectures increase layers, and DRAM memory density increases, sensitivity to contamination and defects have a greater impact on device performance. To achieve optimum wafer yield and reliability, the microelectronics industry needs to address the increased materials consumption requirements and material purity challenges from chemical manufacture to point of use.
Clean Gas Delivery

Explore solutions to the gas purity challenges faced by semiconductor manufacturers.

Automotive Reliability

As automotive electronics become more complex and prevalent, the cost of failure in these devices rises. Hidden defects caused by small particles, gels, metal ions, and organic contaminants can lead to failures throughout the vehicle’s life, escalating costs and increasing risk. How can you prevent hidden defects?
Front-end to Back-end Solutions

Entegris provides full container solutions to monitor, protect, transport, and deliver those valuable wafers from the front-end through to the back-end of the fab.
Operational Excellence

Learn more about operational excellence at Entegris and our focus on material purity and preventing defects, our adherence to safety and environmental standards with technology such as SDS® cylinders, gas cabinets, and delivery systems, and our ability to supply locally.
Chasing the Perfect Pattern

Lithographers in semiconductor manufacturing are tasked with the challenge of creating circuit patterns that meet production yield, parametric performance, and long-term reliability requirements in the electronic devices our digital lives depend upon. To do this, predicting and controlling variables in the manufacturing systems, materials, and processes are critical.

Solutions in Advanced Logic

Learn more about the critical issues that will have to be addressed to cost-effectively produce faster, denser logic devices that are being driven by the Fourth Industrial Revolution.
High Purity Chemical Manufacturing

To enable the effective manufacturing of electronic devices for the Fourth Industrial Revolution, fabs (integrated circuit manufacturers) are challenged with producing denser and more complex chips with smaller line spacing and 3D features. The digital transformation we are all experiencing as consumers present new challenges to material makers, as well as opportunities. Contamination control remains one of the largest challenges as integrated circuit (IC) technology advances.

Cold Chain Bioprocessing

Aramus™ single-use bag assemblies are ideal for cold chain collection and storage. Our single-layer fluoropolymer provides gamma stability with low extactables & leachables(E&L) and has a wide operating temperature range.
The Rare Air of the Semiconductor Fab

Control of airborne molecular contaminants (AMC) enable manufacturers of integrated circuits (IC) to improve their production yield and further assure the integrity of electronic devices. Contaminant removal is achieved with AMC filters throughout the fab environment and at the tool locations.

Internet of Things

The demand for Internet of Things (IoT) devices and related applications is increasing process complexity and driving the need for improvements in materials quality, stability, and purity from manufacture to point of use.

Enabling Advanced Lithography

EUV reticle pods are highly specialized pieces of equipment that fulfill a critical role in EUV lithography. They must protect the reticle during use, storage, and transportation while not introducing additional contamination or damage.

Advanced Coatings

Semiconductor processing at advanced nodes requires extreme levels of cleanliness to minimize the risk of yield loss associated with submicroscopic contaminants. At Entegris, we understand these challenges and offer precision-engineered coatings that extend tool life while improving device yield. 

Holistic Approach to Enabling Device Performance, Yield, and Reliability

Logic devices are getting smaller, and the introduction of 3D architectures that use vertical fins and nanowires in their gate design introduce more complexity to the fabrication process. As technology nodes shrink beyond 10 nm, new materials are required in both FEOL and BEOL processes to enable performance, yield, reliability and cos
The Silicon Precursor Toolbox for Low-Temperature Deposition

A toolbox approach to choosing the most appropriate precursor and plasma combination for a given application makes process development more efficient, benefiting semiconductor device manufacturers and their customer.
Advanced Deposition Materials Innovation

With semiconductor nodes shrinking to 10 nm and below and once-flat architectures evolving into complex 3D structures, whole new paradigms in material deposition must be developed. Entegris takes a holistic approach to advanced material development, yielding industry-leading innovation.
Solving Advanced Technology Challenges with Innovative Materials

As semiconductor nodes shrink to 10 nm and below, improvements in materials and process integration are required. In order to deliver industry-leading innovation, Entegris uses a holistic approach in the development of formulated chemistries, CMP pad conditioners, and brushes.
Electrostatic Discharge (ESD) Prevention

To mitigate the increased risks of ESD, Entegris is developing a continuously conductive PFA system that collects the charge buildup from the media and the fluid handling system and allows an uninterrupted dissipation path to ground.
Low-Temperature Bioprocessing

Addressing low-temperature bioprocess application challenges
End-to-End Gas Filtration Solutions

Explore solutions to the gas filtration challenges faced by semiconductor manufacturers.

Storage Class Memory

The current data explosion is affecting every device that relies on memory storage, from consumer products to enterprise applications. Storage class memory (SCM) occupies a critical middle ground in the spectrum of memory storage.
General Particle Sizing

Advanced-node customers need tools to shorten their process times while maintaining accuracy and consistency to meet high quality manufacturing standards. Our high resolution particle size and count systems help them achieve these goals.
Cars and Chips: The Acceleration of Electronic Systems

As the automotive paradigm shifts from mechanical to electronic-centric vehicles, carmakers must now meet parts per billion (ppb) failure rates. To achieve these goals and improve long-term reliability, they look to semiconductor manufacturers and the automotive component supply chain to collaborate in meeting these goals and assure the functional safety of new modes of transportation.

High-Density Cell Banking

High-Density cell banking (HDCB) intensifies the upstream process by providing a much larger volume of highly concentrated cells to start a production run.