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Industry Insights

If you want a unique and clear point of view on topics that are driving the industry, look no further. Whether it’s challenges in 3D NAND manufacturing or the impact of IoT on the industry, Entegris experts are here to share their perspective.

Targeted Contaminant Removal

Targeted removal is a promising solution that mitigates contaminants which negatively impact wafer yield, device performance, and long-term reliability without disturbing material composition. By collaborating and using targeted contaminant removal strategies, we can solve some of today’s most complex semiconductor manufacturing challenges.

Glass in Front; Glass in Back

Smartphone images are now much more visually appealing thanks to curved, 3D glass. The emergence of 3D glass for smartphones has to do with advancements in glass melting and forming technology – and, in short, the extreme precision with which glass manufacturers can now mold high-tech glass while still meeting the aesthetic and performance demands of today’s consumers.

More Than Just a Chip Tray

Entegris has developed a robust and versatile tray product offering with a catalog of over 16,000 existing designs. We can design from scratch and ship custom trays, meeting the stringent microelectronic and other industries’ quality requirements, in as little as two weeks. Our trays are used in many industries to safeguard, automate, store, and ship a wide variety of products.

3D NAND Solutions

Three-dimensional vertically-stacked memory architectures offer exponential gains in flash memory storage, but they also introduce fundamental new challenges at the device fabrication and integration level. We understand many of these challenges and have ideal solutions for them.

Achieving SAE J2719 Quality Hydrogen for Fuel Cells

Hydrogen (H2) gas is widely used in several industrial applications. As the main fuel for fuel cell technology used in car, bus, and forklift batteries, H2 usage is expanding and its purity specification is crucial.

Advanced Coatings

Semiconductor processing at advanced nodes requires extreme levels of cleanliness to minimize the risk of yield loss associated with submicroscopic contaminants. At Entegris, we understand these challenges and offer precision-engineered coatings that extend tool life while improving device yield.

Advanced Deposition Materials Innovation

With semiconductor nodes shrinking to 10 nm and below and once-flat architectures evolving into complex 3D structures, whole new paradigms in material deposition must be developed. Entegris takes a holistic approach to advanced material development, yielding industry-leading innovation.

Automotive Reliability

As automotive electronics become more complex and prevalent, the cost of failure in these devices rises. Hidden defects caused by small particles, gels, metal ions, and organic contaminants can lead to failures throughout the vehicle’s life, escalating costs and increasing risk. How can you prevent hidden defects?

Cars and Chips: The Acceleration of Electronic Systems

As the automotive paradigm shifts from mechanical to electronic-centric vehicles, carmakers must now meet parts per billion (ppb) failure rates. To achieve these goals and improve long-term reliability, they look to semiconductor manufacturers and the automotive component supply chain to collaborate in meeting these goals and assure the functional safety of new modes of transportation.

Chasing the Perfect Pattern

Lithographers in semiconductor manufacturing are tasked with the challenge of creating circuit patterns that meet production yield, parametric performance, and long-term reliability requirements in the electronic devices our digital lives depend upon. To do this, predicting and controlling variables in the manufacturing systems, materials, and processes are critical.

Chemical Mechanical Planarization (CMP)

Major fabs understand the need for complete solutions that improve yield in all aspects of the CMP process. Shrinking feature size, along with the need for tighter defectivity and particle control in the CMP slurry is driving innovative changes in filtration and monitoring systems. As more layers of each chip require CMP to achieve planarity, the process challenges are increasing dramatically

Clean Chemical Delivery

As logic devices go to smaller line widths, 3D NAND architectures increase layers, and DRAM memory density increases, sensitivity to contamination and defects have a greater impact on device performance. To achieve optimum wafer yield and reliability, the microelectronics industry needs to address the increased materials consumption requirements and material purity challenges from chemical manufacture to point of use.

Clean Gas Delivery

Explore solutions to the gas purity challenges faced by semiconductor manufacturers.

CMP Process Monitoring

Entegris is in the unique position to provide a single sourced process monitoring CMP solution to increase yield, device performance, and system reliability to reduce financial loss in the semiconductor fab and liability in the electronic device supply chain.

Dual Containment Tubing

A safe, reliable system that can be installed or retrofitted in mere hours instead of days. DCT installs easily in areas that are densely populated with other facility plumbing or infrastructure where it is difficult to route rigid PVC containment pipe.

Electrostatic Discharge (ESD) Prevention

To mitigate the increased risks of ESD, Entegris is developing a continuously conductive PFA system that collects the charge buildup from the media and the fluid handling system and allows an uninterrupted dissipation path to ground.

Enabling Advanced Lithography

EUV reticle pods are highly specialized pieces of equipment that fulfill a critical role in EUV lithography. They must protect the reticle during use, storage, and transportation while not introducing additional contamination or damage.

End-to-End Gas Filtration Solutions

Explore solutions to the gas filtration challenges faced by semiconductor manufacturers.

Food and Beverage Contamination Control

Beer, wine, water, juices, and other beverages are a fabric of every society. Each drop has a unique profile, and the drinker’s expectation is based on a lifetime of experiences with your product and your competitors’. To meet these expectations, the quality programs must be comprehensive and consistent.

Front-end to Back-end Solutions

Entegris provides full container solutions to monitor, protect, transport, and deliver those valuable wafers from the front-end through to the back-end of the fab.

High Purity Chemical Manufacturing

To enable the effective manufacturing of electronic devices for the Fourth Industrial Revolution, fabs (integrated circuit manufacturers) are challenged with producing denser and more complex chips with smaller line spacing and 3D features. The digital transformation we are all experiencing as consumers present new challenges to material makers, as well as opportunities. Contamination control remains one of the largest challenges as integrated circuit (IC) technology advances.

Holistic Approach to Enabling Device Performance, Yield, and Reliability

Logic devices are getting smaller, and the introduction of 3D architectures that use vertical fins and nanowires in their gate design introduce more complexity to the fabrication process. As technology nodes shrink beyond 10 nm, new materials are required in both FEOL and BEOL processes to enable performance, yield, reliability and cos

Internet of Things

The demand for Internet of Things (IoT) devices and related applications is increasing process complexity and driving the need for improvements in materials quality, stability, and purity from manufacture to point of use.

Operational Excellence

Learn more about operational excellence at Entegris and our focus on material purity and preventing defects, our adherence to safety and environmental standards with technology such as SDS® cylinders, gas cabinets, and delivery systems, and our ability to supply locally.

Particle Characterization

Entegris is a provider of high-resolution particle size analyzers and particle counters. Understand particle size distribution through dynamic light scattering, single particle optical sizing, laser diffraction and other technologies.

Pervasive Defectivity in Semiconductor Manufacturing

Most equipment and process engineers become experts at analyzing a wafer map to quickly identify signatures. They can easily identify when their equipment or process was the perpetrator of a maverick yield event. But as defect signatures become more subtle and harder to quickly identify, there is a significant need to consider not just what your in-line inspection systems are identifying, but specifically what they are not identifying.

Protecting Your Data Center Environment from Gas-Phase Contamination

Data centers are the most critical elements of Industry 4.0 and Web 2.0. data mining, machine learning, artificial intelligence (AI) the internet of things (IoT) all rely on data center uptime. Data centers typically employ MERV-rated particle filters, but most do not yet consider gas-phase contamination. Airborne molecular contamination (AMC), however, can threaten that data center’s reliability and it needs to be controlled.

The Rare Air of the Semiconductor Fab

Control of airborne molecular contaminants (AMC) enable manufacturers of integrated circuits (IC) to improve their production yield and further assure the integrity of electronic devices. Contaminant removal is achieved with AMC filters throughout the fab environment and at the tool locations.

Silicon Carbide Slurries

The transition from gas-powered to electric vehicles (EVs) is happening at a faster rate than predicted and batteries are also operating at higher voltages. Both these trends put pressure on power integrated circuit (IC) manufacturers to produce higher volumes of chips using technologies designed to withstand high-temperature, high-frequency operating environments. Part of the answer lies in transitioning from silicon substrates to silicon carbide (SiC) and gallium nitride (GaN).

The Silicon Precursor Toolbox for Low-Temperature Deposition

A toolbox approach to choosing the most appropriate precursor and plasma combination for a given application makes process development more efficient, benefiting semiconductor device manufacturers and their customer.

Solid Precursors and Delivery Systems

Device performance requirements are driving the need for new materials and new integration schemes (logic and memory). Many of the materials that enhance device performance can only be deposited using solid precursors, including materials for High-k gate, memory wordline applications, and low resistance metals.

Solutions in Advanced Logic

Learn more about the critical issues that will have to be addressed to cost-effectively produce faster, denser logic devices that are being driven by the Fourth Industrial Revolution.

Solving Advanced Technology Challenges with Innovative Materials

As semiconductor nodes shrink to 10 nm and below, improvements in materials and process integration are required. In order to deliver industry-leading innovation, Entegris uses a holistic approach in the development of formulated chemistries, CMP pad conditioners, and brushes.

Storage Class Memory

The current data explosion is affecting every device that relies on memory storage, from consumer products to enterprise applications. Storage class memory (SCM) occupies a critical middle ground in the spectrum of memory storage.