If you want a unique and clear point of view on topics that are driving the industry, look no further. Whether it’s challenges in 3D NAND manufacturing or the impact of IoT on the industry, Entegris experts are here to share their perspective.
Smartphone images are now much more visually appealing thanks to curved, 3D glass. The emergence of 3D glass for smartphones has to do with advancements in glass melting and forming technology – and, in short, the extreme precision with which glass manufacturers can now mold high-tech glass while still meeting the aesthetic and performance demands of today’s consumers.
Entegris has developed a robust and versatile tray product offering with a catalog of over 16,000 existing designs. We can design from scratch and ship custom trays, meeting the stringent microelectronic and other industries’ quality requirements, in as little as two weeks. Our trays are used in many industries to safeguard, automate, store, and ship a wide variety of products.
Semiconductor processing at advanced nodes requires extreme levels of cleanliness to minimize the risk of yield loss associated with submicroscopic contaminants. At Entegris, we understand these challenges and offer precision-engineered coatings that extend tool life while improving device yield.
With semiconductor nodes shrinking to 10 nm and below and once-flat architectures evolving into complex 3D structures, whole new paradigms in material deposition must be developed. Entegris takes a holistic approach to advanced material development, yielding industry-leading innovation.
As automotive electronics become more complex and prevalent, the cost of failure in these devices rises. Hidden defects caused by small particles, gels, metal ions, and organic contaminants can lead to failures throughout the vehicle’s life, escalating costs and increasing risk. How can you prevent hidden defects?
As the automotive paradigm shifts from mechanical to electronic-centric vehicles, carmakers must now meet parts per billion (ppb) failure rates. To achieve these goals and improve long-term reliability, they look to semiconductor manufacturers and the automotive component supply chain to collaborate in meeting these goals and assure the functional safety of new modes of transportation.
Lithographers in semiconductor manufacturing are tasked with the challenge of creating circuit patterns that meet production yield, parametric performance, and long-term reliability requirements in the electronic devices our digital lives depend upon. To do this, predicting and controlling variables in the manufacturing systems, materials, and processes are critical.
Major fabs understand the need for complete solutions that improve yield in all aspects of the CMP process. Shrinking feature size, along with the need for tighter defectivity and particle control in the CMP slurry is driving innovative changes in filtration and monitoring systems. As more layers of each chip require CMP to achieve planarity, the process challenges are increasing dramatically
As logic devices go to smaller line widths, 3D NAND architectures increase layers, and DRAM memory density increases, sensitivity to contamination and defects have a greater impact on device performance. To achieve optimum wafer yield and reliability, the microelectronics industry needs to address the increased materials consumption requirements and material purity challenges from chemical manufacture to point of use.
To enable the effective manufacturing of electronic devices for the Fourth Industrial Revolution, fabs (integrated circuit manufacturers) are challenged with producing denser and more complex chips with smaller line spacing and 3D features. The digital transformation we are all experiencing as consumers present new challenges to material makers, as well as opportunities. Contamination control remains one of the largest challenges as integrated circuit (IC) technology advances.
Logic devices are getting smaller, and the introduction of 3D architectures that use vertical fins and nanowires in their gate design introduce more complexity to the fabrication process. As technology nodes shrink beyond 10 nm, new materials are required in both FEOL and BEOL processes to enable performance, yield, reliability and cos
Most equipment and process engineers become experts at analyzing a wafer map to quickly identify signatures. They can easily identify when their equipment or process was the perpetrator of a maverick yield event. But as defect signatures become more subtle and harder to quickly identify, there is a significant need to consider not just what your in-line inspection systems are identifying, but specifically what they are not identifying.
Control of airborne molecular contaminants (AMC) enable manufacturers of integrated circuits (IC) to improve their production yield and further assure the integrity of electronic devices. Contaminant removal is achieved with AMC filters throughout the fab environment and at the tool locations.
The transition from gas-powered to electric vehicles (EVs) is happening at a faster rate than predicted and batteries are also operating at higher voltages. Both these trends put pressure on power integrated circuit (IC) manufacturers to produce higher volumes of chips using technologies designed to withstand high-temperature, high-frequency operating environments. Part of the answer lies in transitioning from silicon substrates to silicon carbide (SiC) and gallium nitride (GaN).
Device performance requirements are driving the need for new materials and new integration schemes (logic and memory). Many of the materials that enhance device performance can only be deposited using solid precursors, including materials for High-k gate, memory wordline applications, and low resistance metals.
As semiconductor nodes shrink to 10 nm and below, improvements in materials and process integration are required. In order to deliver industry-leading innovation, Entegris uses a holistic approach in the development of formulated chemistries, CMP pad conditioners, and brushes.