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A300 Thick and Warped Wafer FOUPs

Are specifically designed for supporting heavy thick and warped wafers while providing superior microenvironment control that provides clean and secure 300 mm wafer transport.

  • The 13-capacity design provides additional support for thick and warped wafers while providing extra room for automation to transfer wafers.
  • Purge options are available including front/rear purge that provides maximum gas dispersion
  • Industry-proven door provides equipment interoperability and long life
  • Integral wafer supports allow excellent wafer plane performance and reliable wafer access
  • Read More Read Less
Interested in A300 Thick and Warped Wafer FOUPs?

Contact your Entegris account manager or  contact us

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