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300 mm Front Opening Unified Pods (FOUPs)

FOUP platform with superior microenvironment control

Our FOUPs (front-opening unified pods) hold 300 mm wafers safely and securely while they are transported and transferred within the fab as they move through hundreds of sophisticated process steps. Designed to address not only particles but to also minimize and control VOC, oxygen, and relative humidity (RH), our FOUPs provide superior microenvironment control, optimum automation integration, and low cost of ownership.

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  • Process
Spectra™ FOUPs
Spectra™ FOUPs
Spectra™ FOUPs
A front-opening, unified pod platform with superior microenvironment control. The Spectra™ FOUP provides clean and secure wafer transport, optimum automation in integration and low cost of ownership for your facility.
Industry
  • Semiconductor
 Process
  • Transport
Spectra™ FOUP Accessories
Spectra™ FOUP Accessories
Spectra™ FOUP Accessories
FOUP accessories including color option, configuration option, segregation options and Identification options are available in several varieties.
Industry
  • Semiconductor
 Process
  • Wafer Handling
A300 G3 FOUP Wafer Carrier
A300 G3 FOUP Wafer Carrier
A300 G3 FOUP Wafer Carrier
The A300 G3 FOUP offers advanced wafer isolation technology in a cost-effective design for 300 mm wafer processing.
Industry
  • Semiconductor
 Process
  • Wafer Handling
  • Transport
A300 G3 FOUP Wafer Carrier Accessories
A300 G3 FOUP Wafer Carrier Accessories
A300 G3 FOUP Wafer Carrier Accessories
Many accessories are available for the A300 G3 Front Opening Unified Pod
Industry
  • Semiconductor
 Process
  • Transport
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