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300 mm Front Opening Unified Pods (FOUPs)

FOUP platform with superior microenvironment control

Our FOUPs (front-opening unified pods) hold 300 mm wafers safely and securely while they are transported and transferred within the fab as they move through hundreds of sophisticated process steps. Designed to address not only particles but to also minimize and control VOC, oxygen, and relative humidity (RH), our FOUPs provide superior microenvironment control, optimum automation integration, and low cost of ownership.

Featured Information

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Yield Advantages Through Maintaining and Upgrading FOUP Populations
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Featured Information

download-pdf
Yield Advantages Through Maintaining and Upgrading FOUP Populations
Request White Paper

Featured Information

download-pdf
Yield Advantages Through Maintaining and Upgrading FOUP Populations
Request White Paper
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  • Industry
  • Process
Spectra™ FOUPs
Spectra™ FOUPs
Spectra™ FOUPs
A front-opening, unified pod platform with superior microenvironment control that provides clean and secure wafer transport, optimum automation in integration, and low cost of ownership for your facility
Product Type
  • FOUP
 Industry
  • Semiconductor
 Process
  • Wafer Handling
Spectra™ FOUP Accessories and Replacement Parts
Spectra™ FOUP Accessories and Replacement Parts
Spectra™ FOUP Accessories and Replacement Parts
Spectra™ FOUP accessories including filter membranes and door gaskets that help maintain FOUP fleets, eliminating costly replacements
Product Type
  • Accessories and Replacement Parts
 Industry
  • Semiconductor
 Process
  • Wafer Handling
A300 G3 FOUP Accessories and Replacement Parts
A300 G3 FOUP Accessories and Replacement Parts
A300 G3 FOUP Accessories and Replacement Parts
A300 G3 FOUP accessories including filter membranes and door gaskets that help maintain FOUP fleets, eliminating costly replacements
Product Type
  • Accessories and Replacement Parts
 Industry
  • Semiconductor
 Process
  • Wafer Handling
A300 FOUPs
A300 FOUPs
A300 FOUPs
A300 FOUPs offer advanced wafer isolation technology in a cost-effective, 25- or 13-capacity design for 300 mm wafer processing
Product Type
  • FOUP
 Industry
  • Semiconductor
 Process
  • Wafer Handling
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