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300 mm Front Opening Unified Pods (FOUPs)

Clean, secure wafer transport.

Safely transport, store and protect 300 mm wafers with our line of front-opening unified pods (FOUPs).

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  • Process
Spectra™ FOUPs
Spectra™ FOUPs
Spectra™ FOUPs
A front-opening, unified pod platform with superior microenvironment control. The Spectra™ FOUP provides clean and secure wafer transport, optimum automation in integration and low cost of ownership for your facility.
Industry
  • Semiconductor
 Process
  • Transport
Spectra™ FOUP Accessories
Spectra™ FOUP Accessories
Spectra™ FOUP Accessories
FOUP accessories including color option, configuration option, segregation options and Identification options are available in several varieties.
Industry
  • Semiconductor
 Process
  • Wafer Handling
A300 G3 FOUP Wafer Carrier
A300 G3 FOUP Wafer Carrier
A300 G3 FOUP Wafer Carrier
The A300 G3 FOUP offers advanced wafer isolation technology in a cost-effective design for 300 mm wafer processing.
Industry
  • Semiconductor
 Process
  • Wafer Handling
  • Transport
A300 G3 FOUP Wafer Carrier Accessories
A300 G3 FOUP Wafer Carrier Accessories
A300 G3 FOUP Wafer Carrier Accessories
Many accessories are available for the A300 G3 Front Opening Unified Pod
Industry
  • Semiconductor
 Process
  • Transport
F300 AutoPod® Wafer Carrier
F300 AutoPod® Wafer Carrier
F300 AutoPod® Wafer Carrier
The F300 is engineered and manufactured to provide maximum protection for your wafers from contamination, electrostatic discharge and UV exposure
Industry
  • Semiconductor
 Process
  • Wafer Handling
  • Transport
F300 AutoPod® Accessories
F300 AutoPod® Accessories
F300 AutoPod® Accessories
Industry-leading F300 wafer accessories since 1966.
Industry
  • Semiconductor
 Process
  • Transport
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